Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Jason R. Grenier"'
Autor:
Lars Brusberg, Jason R. Grenier, Aramais R. Zakharian, Lucas W. Yeary, Seong-ho Seok, Jung-hyun Noh, Young-gon Kim, Jurgen Matthies, Chad C. Terwilliger, Barry J. Paddock, Robert A. Bellman, Daniel W. Levesque, Robin M. Force, Clifford G. Sutton, Jeffrey S. Clark, Betsy J. Johnson
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. :1-11
Autor:
Lars Brusberg, Aramais R. Zakharian, Jason R. Grenier, Barry J. Paddock, Daniel W. Levesque, Cliff G. Sutton, Robin M. Force, Lucas W. Yeary, Robert A. Bellman, Chad C. Terwilliger, Betsy J. Johnson
Publikováno v:
IMAPSource Proceedings. 2022
Co-packaged optics leads to significant power reduction by placing the electronic and photonic chiplets in a single package. An integrated electro-optical substrate made of glass with optical waveguides, through vias and electrical redistribution lay
Publikováno v:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII.
Autor:
Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Juergen Matthies, Jeffrey S. Clark, Daniel W. Levesque, Kristopher A. Wieland
Publikováno v:
Optical Interconnects XXIII.
Autor:
Lars Brusberg, Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Betsy J. Johnson, Chad C. Terwilliger
Publikováno v:
2023 Optical Fiber Communications Conference and Exhibition (OFC).
We report connector loss of 0.42 dB for a low-profile fiber-to-chip connector to replace fiber pigtails and enable flip-chip electronic assembly of optical chips for co-packaged optics.
Autor:
Lucas W. Yeary, Aramais R. Zakharian, Jason R. Grenier, Robert A. Bellman, Şükrü Ekin Kocabaş, Lars Brusberg, Chad C. Terwilliger
Publikováno v:
Journal of Lightwave Technology. 39:912-919
Co-packaged optics in next-generation datacenters require the assembly of multiple components on the same multichip module (MCM) and interconnection with hundreds of optical fibers. A novel photonic packaging substrate is required to leverage high-th
Publikováno v:
Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXII.
Autor:
Lars Brusberg, Jason R. Grenier, Şükrü Ekin Kocabaş, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry J. Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, Katerina Rousseva
Publikováno v:
Optical Fiber Communication Conference (OFC) 2022.
A circuit on glass with optical fiber interfaces, integrated planar waveguides, and through glass vias is demonstrated for co-packaged optics hosting and interconnecting electrical and photonic integrated circuits by flip-chip bonding.
Autor:
Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Beibei Zeng, Pierre Beneke, Allen Miller, Chad C. Terwilliger, Lars Brusberg
Publikováno v:
ECOC
Autor:
Chad C. Terwilliger, Katerina Rousseva, Matthew John Dejneka, Lars Brusberg, Jason R. Grenier
Publikováno v:
Optical Interconnects XXI.
Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (I