Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Jason M. Hart"'
Autor:
King C. Yen, Aparna Ramachandran, Timothy P. Johnson, Yongning Sheng, Jason M. Hart, Daisy Jian, Rakesh Mehta, Yuefei Ge, Dawei Huang, Lance Kwong, Hoyeol Cho, Zuxu Qin, Changku Hwang, Jinuk Luke Shin, Umesh Gajanan Nawathe, Robert P. Masleid, Venkat Krishnaswamy, Georgios Konstadinidis, Hari Sathianathan, Gregory Gruber, Sebastian Turullols
Publikováno v:
ISSCC
The 3.6 GHz SPARC T5 processor is Oracle's next generation CMT SoC processor implemented in TSMC's 28 nm process with 1.5 billion transistors. Significant performance improvements were made by doubling the previous generations number of cores to 16 a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9a65bf3aeb8482508a1512e9ba2b864
https://doi.org/10.1109/jssc.2013.2284648
https://doi.org/10.1109/jssc.2013.2284648
Autor:
John Wu, J. Hsu, G. Gruber, Anand Dixit, D. Chen, Jason M. Hart, D. Greenley, C. Chou, K. Ho, N.G. Malur, Lik T. Cheng, K.T. Lee
Publikováno v:
IEEE Journal of Solid-State Circuits. 41:210-217
This fourth-generation processor combines two enhanced third-generation cores using an advanced 90-nm dual-Vt, dual-gate-oxide technology. Hardware additions feature expanded caches and inclusion of a 2-MB Level-2 cache and a Level-3 tag. Layout was
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::313518a13f63277935c31ac6afcea06d
https://doi.org/10.1109/jssc.2005.859895
https://doi.org/10.1109/jssc.2005.859895
Autor:
Sebastian Turullols, Jinuk Luke Shin, Jason M. Hart, Dawei Huang, Venkatram Krishnaswamy, Georgios Konstadinidis
Publikováno v:
2013 IEEE Asian Solid-State Circuits Conference (A-SSCC).
The SPARC T5 processor implements 16 8-threaded SPARC S3 cores, an 8-MB 16-way set-associative L3 cache, 8 BL8 DDR3-1066 schedulers, and integrated PCIe Gen-3. The processor doubles the performance of the previous generation SPARC T4 CPU and expands
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9b223a29abb3e502ca0bbed8adb68e1
https://doi.org/10.1109/asscc.2013.6690971
https://doi.org/10.1109/asscc.2013.6690971