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pro vyhledávání: '"Jason Lee Frankel"'
Autor:
Joe Zou, Charles L. Reynolds, Charles Woychik, Thomas A. Wassick, Ravi K. Bonam, Cindy Han, Jason Lee Frankel, Masahiro Tsuriya, Glenn A. Pomerantz, Feng Xue
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
The demand for integrated silicon packages is driving packaging advancements for increasingly fine circuit pattern designs. Due to the thinner copper and finer features required for advanced packaging, copper line defects can significantly impact yie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b90e55c183466c794ca04502c1dd80f2
https://doi.org/10.23919/icep.2019.8733543
https://doi.org/10.23919/icep.2019.8733543
