Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Jason C. C. Mak"'
Autor:
Saeed Sharif Azadeh, Jason C. C. Mak, Hong Chen, Xianshu Luo, Fu-Der Chen, Hongyao Chua, Frank Weiss, Christopher Alexiev, Andrei Stalmashonak, Youngho Jung, John N. Straguzzi, Guo-Qiang Lo, Wesley D. Sacher, Joyce K. S. Poon
Publikováno v:
Nature Communications, Vol 14, Iss 1, Pp 1-8 (2023)
Abstract Laser beam scanning is central to many applications, including displays, microscopy, three-dimensional mapping, and quantum information. Reducing the scanners to microchip form factors has spurred the development of very-large-scale photonic
Externí odkaz:
https://doaj.org/article/0dfb6ec9e0b2468eb86779e5377af2b9
Autor:
Yiding Lin, Zheng Yong, Xianshu Luo, Saeed Sharif Azadeh, Jared C. Mikkelsen, Ankita Sharma, Hong Chen, Jason C. C. Mak, Patrick Guo-Qiang Lo, Wesley D. Sacher, Joyce K. S. Poon
Publikováno v:
Nature Communications, Vol 13, Iss 1, Pp 1-7 (2022)
Efficient and broadband visible-light photodetectors will bring great advantages in applications such as biosensing and quantum information. Here the authors develop a photodetector with high quantum efficiency across broad wavelength range suitable
Externí odkaz:
https://doaj.org/article/61987d55d31441b68259a4f5481b8c7e
Autor:
Torrey Thiessen, Jason C. C. Mak, Florian Denis-Le Coarer, Zheng Yong, Kevin Froberger, Marylise Marchenay, Martin Peyrou, Laurent Milord, Joyce K. S. Poon, Christophe Jany, Sylvie Menezo
Publikováno v:
2023 Optical Fiber Communications Conference and Exhibition, OFC 2023-Proceedings
We demonstrate a 4λx8 output DFB laser comb source with 94GHz channel spacing. The comb source produces approximately 1mW of fiber-coupled power per wavelength per fiber with 2dB power variability across all 32 output channels.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::13c5344e05ebd9f9e34b3975ccf550f5
https://hdl.handle.net/21.11116/0000-000D-5AA8-121.11116/0000-000D-5AAA-F
https://hdl.handle.net/21.11116/0000-000D-5AA8-121.11116/0000-000D-5AAA-F
Autor:
Wesley D. Sacher, Yiding Lin, Hong Chen, Saeed S. Azadeh, Zheng Yong, Xianshu Luo, Hongyao Chua, Jason C. C. Mak, Alperen Govdeli, Ankita Sharma, Jared C. Mikkelsen, Xin Mu, Andrei Stalmashonak, Guo-Qiang Lo, Joyce K. S. Poon
Publikováno v:
2023 Optical Fiber Communications Conference and Exhibition, OFC 2023-Proceedings
We present a foundry-fabricated monolithically integrated photonics platform for the visible spectrum (λ=445–640nm) with two layers of silicon nitride waveguides, silicon photodiodes, efficient undercut thermo-optic phase shifters, in situ trimmin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::79289a957fae53c3920c59cb335a1710
https://doi.org/10.1364/ofc.2023.tu3c.5
https://doi.org/10.1364/ofc.2023.tu3c.5
Autor:
Saeed Sharif Azadeh, Jason C. C. Mak, Hong Chen, Xianshu Luo, Fu-Der Chen, Hongyao Chua, Frank Weiss, Christopher Alexiev, Andrei Stalmashonak, Youngho Jung, John N. Straguzzi, Guo-Qiang Lo, Wesley D. Sacher, Joyce K. S. Poon
Publikováno v:
Nature Communications
Laser beam scanning is central to many applications, including displays, microscopy, three-dimensional mapping, and quantum information. Reducing the scanners to microchip form factors has spurred the development of very-large-scale photonic integrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cb940d94299f0504f7af8487e7a87a97
Autor:
Hong Chen, Yiding Lin, Patrick Guo-Qiang Lo, Wesley D. Sacher, Xin Mu, Xianshu Luo, Youngho Jung, Andrei Stalmashonak, Jason C. C. Mak, Joyce K. S. Poon
Publikováno v:
Optics Express
Low-loss broadband fiber-to-chip coupling is currently challenging for visible-light photonic-integrated circuits (PICs) that need both high confinement waveguides for high-density integration and a minimum feature size above foundry lithographical l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9c6267b222a8e9dbcfeb5ad8217c0d48
https://pubmed.ncbi.nlm.nih.gov/34809243
https://pubmed.ncbi.nlm.nih.gov/34809243
Autor:
Jason C. C. Mak, Patrick Guo-Qiang Lo, Fu-Der Chen, Joyce K. S. Poon, Tianyuan Xue, Michael L. Roukes, Youngho Jung, Wesley D. Sacher, Xianshu Luo
Publikováno v:
CLEO: Science and Innovations 2021
We demonstrate implantable neural probes with integrated silicon nitride optical phased arrays (OPAs) fabricated on 200mm wafers for wavelengths near 480nm. A free-propagation slab enables the emission of a single steerable beam from an OPA.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e8ec1785ee32bd3b770a9d78af99a199
https://doi.org/10.1364/cleo_si.2021.sw3b.2
https://doi.org/10.1364/cleo_si.2021.sw3b.2
Autor:
Patrick Guo-Qiang Lo, Xin Mu, Jason C. C. Mak, Youngho Jung, Joyce K. S. Poon, Yiding Lin, Andrei Stalmashonak, Wesley D. Sacher, Hong Chen, Xianshu Luo
Publikováno v:
CLEO: Science and Innovations 2021
We report low-loss silicon nitride bi-layer fiber-to-chip edge couplers on 200-mm silicon wafers for visible spectrum photonic circuits. The minimum per-facet coupling loss at λ=488nm was ~2.6dB (TM), and polarization-independent coupling was achiev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a6751dddcddb7be640140042a48287b
https://doi.org/10.1364/cleo_si.2021.sm4c.7
https://doi.org/10.1364/cleo_si.2021.sm4c.7
Publikováno v:
Optics Express
We demonstrate foundry-fabricated O-band III-V-on-silicon discrete-mode lasers. The laser fabrication follows the back-side-on-buried-oxide laser integration process and is compatible with complex, multilayer, silicon-on-insulator based platforms. A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1dbb5fe08bf172dbfe7bd8b4917bca68
https://hdl.handle.net/21.11116/0000-0008-20B4-821.11116/0000-0008-20B2-A
https://hdl.handle.net/21.11116/0000-0008-20B4-821.11116/0000-0008-20B2-A
Autor:
Jason C. C. Mak, Sylvie Menezo, Karen Ribaud, Joyce K. S. Poon, Torrey Thiessen, Jeremy Da Fonseca, Christophe Jany
Publikováno v:
Journal of Lightwave Technology
We introduce a new III-V-on-Silicon (Si) heterogeneous integration platform, where the III-V material is bonded to the back of a processed Si photonic wafer. This “Back-Side-on-Buried Oxide” (BSoBOX) process is fully compatible with active, multi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::98e2dad7d149ba51f529d3a171f8e991
https://hdl.handle.net/21.11116/0000-0008-20B9-321.11116/0000-0008-20BB-1
https://hdl.handle.net/21.11116/0000-0008-20B9-321.11116/0000-0008-20BB-1