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pro vyhledávání: '"Jasmond Lee Thiam Kwee"'
Autor:
Low, Eu Poh Leng, A. D. Trigg, Sheryl Yong Puay Fen, Calvin Chua Hung Ming, V. P. Ganesh, Chai Tai Chong, Chen Ping, Sharon Chan Sok Mung, Tan Lan Chu, Jasmond Lee Thiam Kwee
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
The use of copper wire for wire bonding integrated circuits (ICs) has increased significantly in recent years, driven mainly by the dramatic increase in the cost of gold. The technical advantages and limitations, particularly with respect to reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714921e40f72c865511536c9693d613b
https://doi.org/10.1109/eptc.2012.6507072
https://doi.org/10.1109/eptc.2012.6507072
