Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jasmine Woo"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74f0a8e719966cfeeafa1b0a1f6d8967
https://doi.org/10.1109/eptc56328.2022.10013251
https://doi.org/10.1109/eptc56328.2022.10013251
Publikováno v:
2020 IEEE Power & Energy Society General Meeting (PESGM).
This paper presents a web-browser based visualization tool for displaying extensive dynamic contingency outputs, generated by the Dynamic Contingency Analysis Tool (DCAT). DCAT is an open-platform and publicly available methodology to help develop ap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8792b8768a59a8e360440e67c419aee
https://doi.org/10.1109/pesgm41954.2020.9281993
https://doi.org/10.1109/pesgm41954.2020.9281993
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Pure Gallium metal is a good adhesive agent which can be used to paste small coupons on full wafer for metal growth in high temperature PVD chamber as Ga has low vapor pressure in high temperature. However, when the process chamber exceeds a certain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a03aa12f54efd1c9f26b03cbd598918b
https://doi.org/10.1109/eptc.2016.7861434
https://doi.org/10.1109/eptc.2016.7861434
Effect of nitrogen and oxygen annealing on the morphology and hardness behavior of copper thin films
Autor:
Chi Fo Tsang, Jasmine Woo
Publikováno v:
Materials Characterization. 45:187-194
The morphology and hardness behavior of the 0.25-μm thick, chemical vapor-deposited (CVD) copper on SiO 2 on top of Si substrates annealed under oxygen and nitrogen atmosphere were evaluated by atomic force microscopy (AFM) and ultra micro-indentati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcf70e8d27668f97e2d76f8dda53e5be
https://doi.org/10.1016/s1044-5803(00)00072-3
https://doi.org/10.1016/s1044-5803(00)00072-3
Publikováno v:
2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Focused Ion Beam (FIB) milling has been widely used for the preparation of TEM specimens in both cross-section and plan view configurations. FIB induced damage is a non-negligible influence on making a thin and clear TEM specimen. Low-KV FIB is one o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf3fffc55aea3a527cd98e4f4eddca76
https://doi.org/10.1109/ipfa.2010.5531982
https://doi.org/10.1109/ipfa.2010.5531982