Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Jaroslav Jankovsky"'
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al$_{2}O_{3}$). The electrical current load concerning the width o
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
This article describes a system for maintaining the dispensing capillary at a constant height above the surface of the substrate. Used substrates are not sufficiently planar and it is therefore necessary to correct the height of the capillary during
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE).
High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning process
Publikováno v:
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.
This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real
Publikováno v:
Proceedings of the 36th International Spring Seminar on Electronics Technology.
This paper deals with dispensing technology process, some times known “writing”, regarding high resolution deposition of thixotropic materials including standard conductor, resistor and dielectric thick film pastes with common viscosity values. T
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
This article describes the new possibility for higher quality deposition of thick film and similar materials with thixotropic character. Additional ultrasonic energy allows the local influence of the viscosity inside the dispensing system. Thixotropi
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
The reliable semiconductor chip's wire bonding is one of the basic steps for the receiving good quality of final electronic system as well suitable economical solution. This paper describes some results obtained during our research work concerning de
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
The lead-free soldering, required by RoHS legislative, has brought many new factors in the solder process as well in reliability and longevity of solder joints, which occur in high quantity in most electronic equipments and systems. In this paper is
Publikováno v:
33rd International Spring Seminar on Electronics Technology, ISSE 2010.
This paper deals with the investigation of wire bonding power interconnection for standard CMOS chips, which is very important for power application. Base part of this research is the determination of power load by the wire. For testing are design tw
Publikováno v:
33rd International Spring Seminar on Electronics Technology, ISSE 2010.
The article describes the construction of the wind box to evaluate the thermal conditions at the hardware parts of the computers. Aerodynamics box is accompanied by temperature sensors for monitoring temperature conditions at the inputs and outputs o