Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Jaron Kuppers"'
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 233:1168-1181
A low-cost, low-waste manufacturing method for advanced thermoset composite parts could improve market penetration of composites compared to other engineering materials such as aluminum or steel. Such a method could combine some of the new trends in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::740e559d53b2230042413b5ab1408725
https://doi.org/10.1177/0954405418769950
https://doi.org/10.1177/0954405418769950
Publikováno v:
Journal of Manufacturing Science and Engineering. 139
The capabilities of specialized elastomeric tooling (SET), a low-cost and low-energy autoclave alternative for consolidating and curing thermoset and thermoplastic composite parts made of “prepreg” material, are expanded to allow vacuum infusion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0eee6d24e1597e84ceb163fc68d530a2
https://doi.org/10.1115/1.4034276
https://doi.org/10.1115/1.4034276
Autor:
Jaron Kuppers, Daniel Walczyk
Publikováno v:
Composites Part A: Applied Science and Manufacturing. 43:635-646
An alternative process to autoclaving, called Thermal Press Curing (TPC), is proposed, whereby an uncured composite laminate is pressed between a heated curing mold and customized rubber-faced mold that are designed to provide uniform temperature and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a7c82ee526827827c215dd1a89ca84f
https://doi.org/10.1016/j.compositesa.2011.12.008
https://doi.org/10.1016/j.compositesa.2011.12.008
Publikováno v:
Journal of Nanoscience and Nanotechnology. 8:3999-4002
The paper reports morphology and structure transitions of silicon carbide (SiC) nanowires during high temperature annealing; the as-prepared nanowires are in the form of SiC core and SiO2 shell. The transition temperature is about 1200 °C, 600 °C l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dba117e087962e1eb26cd4dc20007483
https://doi.org/10.1166/jnn.2008.18347
https://doi.org/10.1166/jnn.2008.18347
Autor:
Jaron Kuppers, Daniel Walczyk
Publikováno v:
Journal of Manufacturing Science and Engineering. 136
Thermal press curing (TPC) is an alternative process to autoclaving for consolidating and curing thermoset and thermoplastic prepreg composite parts by pressing them between a heated “curing mold” and a customized rubber-faced “base mold” tha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d27de4e01346d3cb80245c3a339633c
https://doi.org/10.1115/1.4026043
https://doi.org/10.1115/1.4026043
Publikováno v:
ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1.
Curing and consolidating thermoset composite laminates and sandwich structures typically involves vacuum bagging an uncured and formed layup over a thin-walled mold, placing it in an autoclave, and subjecting the entire unit to temperature, vacuum an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e09ea611415d7242cd45c3f20844d5c
https://doi.org/10.1115/msec2010-34054
https://doi.org/10.1115/msec2010-34054
Autor:
Hanchen Huang, Jaron Kuppers, Eduardo Castillo, Sadia Choudhury, Hyun Woo Shim, Diana-Andra Borca-Tasciuc
Publikováno v:
Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C.
This paper reports on thermal characterization of SiC nanowire films on alumina substrate. The SiC nanowires films were synthesized via carbothermal reduction by thermal evaporation of silica and graphite powders using a high temperature alumina tube
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d87edb02256b70a342fc428ce4e2726c
https://doi.org/10.1115/imece2008-67321
https://doi.org/10.1115/imece2008-67321
Publikováno v:
Nanotechnology. 20:025704
Nanostructures exhibit strong adhesion, which gives rise to friction even without normal loads. For technological applications, friction involves non-zero compressive loads. However, such frictional behavior of the 1D nanostructures remains unknown.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be8f3701d46df1065aaee1886dac742b
https://doi.org/10.1088/0957-4484/20/2/025704
https://doi.org/10.1088/0957-4484/20/2/025704