Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Jaron D. Kuppers"'
Autor:
David A. Czaplewski, Jordan E. Massad, William D. Cowan, Jaron D. Kuppers, Christopher W. Dyck, Isak C. Reines, Christopher P. Tigges, Hartono Sumali
Publikováno v:
Journal of Microelectromechanical Systems. 15:1586-1594
A soft-landing actuation waveform was designed to reduce the bounce of a single-pole single-throw (SPST) ohmic radio frequency (RF) microelectromechanical systems (MEMS) switch during actuation. The waveform consisted of an actuation voltage pulse, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b6e2911b457bf8b876582cdcdf5564a
https://doi.org/10.1109/jmems.2006.883576
https://doi.org/10.1109/jmems.2006.883576
Publikováno v:
Volume 11: Micro and Nano Systems, Parts A and B.
This study examines the effects of bond pads on the measurement of thermal conductivity for micromachined polycrystalline silicon using suspended test structures and a steady state resistance method. Bond pad heating can invalidate the assumption of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41750060c1ecc2532e5957b29905601e
https://doi.org/10.1115/imece2007-41349
https://doi.org/10.1115/imece2007-41349
A capability for measuring the thermal conductivity of microelectromechanical systems (MEMS) materials using a steady state resistance technique was developed and used to measure the thermal conductivities of SUMMiT{trademark} V layers. Thermal condu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0986537727e29cfab265702590c4513
https://doi.org/10.2172/897917
https://doi.org/10.2172/897917
Publikováno v:
Microelectromechanical Systems.
The radio-frequency micro-electromechanical system (RF MEMS) switch comprises a plate suspended by four double-cantilever springs. When electrostatic actuation is applied, the plate moves toward the substrate and closes the switch. This article discu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdca6a4f7e25f4a086dc4ba485432011
https://doi.org/10.1115/imece2005-80956
https://doi.org/10.1115/imece2005-80956