Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Jarne Machiels"'
Printed Electronics (PE) involves additive deposition of functional materials on a substrate via printing processes to realize electronic circuits, interconnects, electrical components or devices. This methodology is opposite to the conventional micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::84d5d6072b2c2caacd4271878d0c7c7b
https://lirias.kuleuven.be/handle/123456789/659539
https://lirias.kuleuven.be/handle/123456789/659539
Autor:
Kamatchi Jothiramalingam Sankaran, Satish Kumar Mylavarapu, An Hardy, Santosh Kumar Bikkarolla, Ronald Thoelen, James McLaughlin, Wim Deferme, Jarne Machiels, Manoj Jose
Publikováno v:
Advanced Engineering Materials. 24:2101087
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41647bb90231af337ebf335ee5b999d2
https://doi.org/10.1002/adem.202101087
https://doi.org/10.1002/adem.202101087
Autor:
Dimitri Adons, Marie Geiβler, Thomas Weissbach, Zander Henckens, Akash Verma, Katrin Kuehnoel, Mieke Buntinx, Lydia Tempel, Wim Deferme, Arved C. Hübler, Wouter Van Rompaey, Roos Peeters, Eleonora Ferraris, Jarne Machiels, Raf Appeltans, Elien Segers, Dieter Klaus Bauer
Publikováno v:
Materials
Volume 14
Issue 19
Materials, Vol 14, Iss 5500, p 5500 (2021)
Volume 14
Issue 19
Materials, Vol 14, Iss 5500, p 5500 (2021)
Intelligent packaging is an emerging technology, aiming to improve the standard communication function of packaging. Radio frequency identification (RFID) assisted smart packaging is of high interest, but the uptake is limited as the market needs cos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5277e2c32295097d13b06628e233a8ae
https://doi.org/10.3390/ma14195500
https://doi.org/10.3390/ma14195500