Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Jari Malm"'
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 406:152-155
Atomic layer deposition (ALD) was used to grow Ti x Al y N and Ti x Al y C thin films using trimethylaluminum (TMA), titanium tetrachloride and ammonia as precursors. Deposition temperature was varied between 325 °C and 500 °C. Films were also anne
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 406:156-160
High-aspect ratio porous structures with controllable pore diameters and without a stiff substrate can be fabricated using the ion track technique. Atomic layer deposition is an ideal technique for depositing thin films and functional surfaces on com
Publikováno v:
IEEE Transactions on Applied Superconductivity. 25:1-4
peerReviewed
Autor:
P. Rahkila, Matti Putkonen, Ma Hongqiang, Timo Sajavaara, Maarit Karppinen, Jari Malm, Harry J. Whitlow, A.R. Ananda Sagari, Mikko Laitinen
Publikováno v:
Thin Solid Films. 531:26-31
Amorphous Ca–P–O films were deposited on titanium substrates using atomic layer deposition, while maintaining a uniform Ca/P pulsing ratio of 6/1 with varying number of atomic layer deposition cycles starting from 10 up to 208. Prior to film depo
Autor:
K. M. Kinnunen, Joseph W. Fowler, Carl D. Reintsema, Joel N. Ullom, Daniel S. Swetz, Marko Käyhkö, Daniel Schmidt, Mikko Laitinen, Jaakko Julin, Timo Sajavaara, Jari Malm, Ilari Maasilta, M. R. J. Palosaari, William B. Doriese
Publikováno v:
Physical Review Applied. 6
Nondestructive analysis (NDA) based on x-ray emission is widely used, for example, in the semiconductor and concrete industries. Here, we demonstrate significant quantitative and qualitative improvements in broadband x-ray NDA by combining particle-i
Autor:
Riikka L. Puurunen, Helena Ronkainen, Antti Vaajoki, Lauri Kilpi, Marko Tuominen, Sakari Sintonen, Jari Malm, Oili Ylivaara
Publikováno v:
Kilpi, L, Ylivaara, O M E, Vaajoki, A, Malm, J, Sintonen, S, Tuominen, M, Puurunen, R L & Ronkainen, H 2016, ' Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon ', Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, vol. 34, no. 1, 01A124 . https://doi.org/10.1116/1.4935959
The scratch test method is widely used for adhesion evaluation of thin films and coatings. Usual critical load criteria designed for scratch testing of coatings were not applicable to thin atomic layer deposition (ALD) films on silicon wafers. Thus,
Publikováno v:
CHEMICAL VAPOR DEPOSITION. 18(7-9):245-248
Here we report a new atomic layer deposition (ALD) process for WO3 thin films based on W(CO)6 as a tungsten source and ozone as a source of oxygen. A narrow ALD temperature window is found at 195–205 °C for WO3 with a deposition rate of 0.23 A per
Publikováno v:
Applied Surface Science. 257:6435-6439
Features of the two thin-film techniques, atomic layer deposition (ALD) and molecular layer deposition (MLD), are combined to build up a stable novel inorganic–organic hybrid material of the (–Ti–N–C6H4–O–C6H4–N–)n type, deposited fro
Autor:
Juuso T. Korhonen, Jari Malm, Robin H. A. Ras, Maarit Karppinen, Olli Ikkala, Panu Hiekkataipale
Publikováno v:
ACS Nano. 5:1967-1974
Hollow nano-objects have raised interest in applications such as sensing, encapsulation, and drug-release. Here we report on a new class of porous materials, namely inorganic nanotube aerogels that, unlike other aerogels, have a framework consisting
Publikováno v:
THIN SOLID FILMS. 519(16):5319-5322
Low-temperature atomic layer deposition (ALD) processes are intensely looked for to extend the usability of the technique to applications where sensitive substrates such as polymers or biological materials need to be coated by high-quality thin films