Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Jared Harvest"'
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Impingement cooling with different tested fluids has been widely accepted and used to dissipate high transient and steady state localized heat loads. There are a plethora of advantages of direct impingement cooling over traditional cooling methods bu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7935eac8ef9d9e32a32ca816aa1037f
https://doi.org/10.1109/itherm.2018.8419558
https://doi.org/10.1109/itherm.2018.8419558
Autor:
Palkesh Jain, Mehdi Saeidi, Jared Harvest, Sivasubramani Krishnaswamy, Aniket Abhay Kulkarni, Ankit Adhiya
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Power saving techniques and associated thermal management are inevitable for present day smartphones. Smartphones employ thermal feedback (temperature at key locations) based dynamic power management strategies to maintain the system temperature in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::564eb2560c23ac0380858813f8adaa26
https://doi.org/10.1109/itherm.2017.7992482
https://doi.org/10.1109/itherm.2017.7992482
Publikováno v:
International Journal of Thermal Sciences. 46:253-261
The localized thermal interactions between adjacent devices on vertically orientated circuit boards in natural convection are predicted using experimentally validated computational fluid dynamics models. The effects of power density, device proximity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5590b10fa39327a33b59c57b10416dec
https://doi.org/10.1016/j.ijthermalsci.2006.04.018
https://doi.org/10.1016/j.ijthermalsci.2006.04.018
Publikováno v:
Heat Transfer: Volume 4.
This study uses experimentally validated computational fluid dynamics models to predict the behavior of the localized thermal interactions between adjacent components on vertically orientated circuit boards in natural convection. Using the developed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce42f59d52648ce13b7e44f5f6c28242
https://doi.org/10.1115/ht2005-72254
https://doi.org/10.1115/ht2005-72254