Zobrazeno 1 - 10 of 45 pro vyhledávání: '"Janusz Sitek"'
1
Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates
Autor: Aleksandra Dybeł, Paweł Czaja, Janusz Sitek, Janusz Pstruś
Publikováno v: Journal of Materials Engineering and Performance.
This paper presents the results of the Ni substrate wetted with the liquid Sn-Zn eutectic alloy with the addition of Ag, Al, and Li (84.3 at.% Sn, 13.7 at.% Zn, 1 at.% Ag, 0.5 at.% Al, and 0.5 at.% Li-SZAAL). The wetting tests were performed using tw
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e126b9e2c3f81c0705b8f7bf7736d896
https://doi.org/10.1007/s11665-023-08155-2
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2
The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials
Autor: Janusz Borecki, Janusz Sitek, Tomasz Serzysko, Marek Koscielski
Publikováno v: Soldering & Surface Mount Technology. 29:23-27
Purpose The purpose of this paper is to evaluate the influence of solder powders sizes applied in soldering materials used for Package-on-Package (PoP) system manufacture as well as other factors on reliability and mechanical strength of created sold
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::04a585c49f1e7225537a5442d57e3e3f
https://doi.org/10.1108/ssmt-10-2016-0024
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3
Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products
Autor: Wojciech Stęplewski, Gerhard Podhradsky, Roland Ambrosch, Aneta Arazna, Kamil Janeczek, Piotr Ciszewski, Janusz Sitek, Piotr Dawidowicz, Marek Koscielski
Publikováno v: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
A positive trend towards circular economy in many domains has been observed. This approach is based on reuse, repair activities that would lead to new functional device or a retrofitting that would lead to a new product. The standard period of use of
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a15d511bee43b38642da8dd56f5941e9
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8
Investigations of BGA components’balls remanufacturing techniques for Circular Economy applications
Autor: Aneta Arazna, Marek Koscielski, Wojciech Stęplewski, Janusz Sitek, Kamil Janeczek
Publikováno v: 2018 7th Electronic System-Integration Technology Conference (ESTC).
This article presents the results of research aimed to evaluate the feasibility of automatic remanufacturing of BGA components balls using different techniques. It was presented possibility of component’s balls process optimization for each techniq
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6eca99549882a2642644b5f095210df2
https://doi.org/10.1109/estc.2018.8546357
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9
Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology
Autor: Piotr Ciszewski, Wojciech Stęplewski, Kamil Janeczek, M. Kościelski, Tomasz Krzaczek, K. Lipiec, Janusz Sitek
Publikováno v: Soldering & Surface Mount Technology. 27:98-102
Purpose – The purpose of this paper is to evaluate the influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) Technology and demonstrate factors important for this issue. Design/methodology/approach –
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3eb8ef1a39ad35a1ffabe9e7367dd10c
https://doi.org/10.1108/ssmt-03-2015-0011
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10
Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs
Autor: Janusz Sitek, Wojciech Stęplewski, Piotr Ciszewski, Kamil Janeczek, A. Araźna, K. Futera, K. Lipiec
Publikováno v: Soldering & Surface Mount Technology. 27:120-124
Purpose – The purpose of this paper is to evaluate the reliability of solder joints made on long FR-4 and metal core printed circuit boards using the accelerated thermal cycling. Design/methodology/approach – Solder joints of diodes and resistors
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::288d51574d35fb167fa6568f5ff676bb
https://doi.org/10.1108/ssmt-03-2015-0009
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