Zobrazeno 1 - 10
of 105
pro vyhledávání: '"Janssen, J.H.J."'
Autor:
van Driel, W.D., Liu, C.J., Zhang, G.Q., Janssen, J.H.J., van Silfhout, R.B.R., van Gils, M.A.J., Ernst, L.J.
Publikováno v:
In Microelectronics Reliability 2004 44(12):2019-2027
Publikováno v:
In Microelectronics Reliability 2003 43(5):765-774
Publikováno v:
EuroSime 2006 - 7th International Conference on Thermal, Mechanical & Multiphysics Simulation & Experiments in Micro-Electronics & Micro-Systems; 2006, p1-6, 6p
Autor:
van Silfhout, R.B.R., van Driel, W.D., Li, Y., van Gils, M.A.J., Janssen, J.H.J., Zhang, G.Q., Tao, G., Bisschop, J., Ernst, L.J.
Publikováno v:
Proceedings of the 5th International Conference on Thermal & Mechanical Simulation & Experiments in Microelectronics & Microsystems, 2004. EuroSimE 2004; 2004, p69-74, 6p
Publikováno v:
Nineteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium, 2003; 2003, p319-323, 5p
Autor:
Yang, D.G., Zhang, G.Q., Ernst, L.J., van 't Hof, C., Caers, J.F.J.M., Bressers, H.J.L., Janssen, J.H.J.
Publikováno v:
IEEE Transactions on Components and Packaging Technologies, 26 (2) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies]
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::f08e2794d52b984f5eba0afcce8a2433
http://resolver.tudelft.nl/uuid:99943327-4858-44b2-9cbc-045c2f154c46
http://resolver.tudelft.nl/uuid:99943327-4858-44b2-9cbc-045c2f154c46
Publikováno v:
2015 16th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems; 2015, p1-7, 7p
Autor:
van Silfhout, R.B.R., de Boer, A., Geijselaers, H.J.M., Li, Y., Bisschop, J., Kuper, F., Schravendeel, R.L., Janssen, J.H.J., van Driel, W.D., Zhang, G.Q., Jansen, M., Zhang, Q.Q.
Publikováno v:
Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001): 9-11 April 2001, Maison de la Chimie, Paris, France, 277-289
STARTPAGE=277;ENDPAGE=289;TITLE=Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001)
STARTPAGE=277;ENDPAGE=289;TITLE=Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::e415facb9f470e1fb709e963253bb832
https://research.utwente.nl/en/publications/541f7400-9dd4-4acd-b209-eeeb03c9b190
https://research.utwente.nl/en/publications/541f7400-9dd4-4acd-b209-eeeb03c9b190
Autor:
Janssen, J.H.J., Veendrick, H.J.M.
Publikováno v:
2009 15th International Workshop on Thermal Investigations of ICs & Systems; 2009, p31-35, 5p
Autor:
Li, Y., van Gils, M.A.J., van Driel, W.D., van Silfhout, R.B.R., Bisschop, J., Janssen, J.H.J., Zhang, G.Q.
Publikováno v:
2008 IEEE International Reliability Physics Symposium; 2008, p455-461, 7p