Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jan-Willem Burssens"'
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 72:1-12
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28996b6e7f2aa2d4284ef021ed12c747
https://doi.org/10.1109/tim.2023.3268486
https://doi.org/10.1109/tim.2023.3268486
Autor:
Aojie Quan, Hemin Zhang, Chen Wang, Jan-Willem Burssens, Linlin Wang, Chenxi Wang, Michel De Cooman, Michael Kraft
Publikováno v:
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ccb76777babe14995c4b647fb64222e
https://doi.org/10.1109/mems51670.2022.9699769
https://doi.org/10.1109/mems51670.2022.9699769
Autor:
Nicolas Dupré, Olivier Dubrulle, Samuel Huber, Jan-Willem Burssens, Christian Schott, Gael Close
Publikováno v:
Proceedings, Vol 2, Iss 13, p 763 (2018)
This paper experimentally demonstrates the stray-field robustness capability of a novel Hall-based rotary position sensor concept (Huber, S., et al, 2018). The sensor targets safety-related automotive applications, for example powertrain and power st
Externí odkaz:
https://doaj.org/article/4f7aabbd4df940c39a850bf8de53a846
Autor:
Samuel Huber, Jan-Willem Burssens, Nicolas Dupré, Olivier Dubrulle, Yves Bidaux, Gael Close, Christian Schott
Publikováno v:
Proceedings, Vol 2, Iss 13, p 809 (2018)
Contactless magnetic position sensors are used in countless industrial and automotive applications. However, as a consequence of the electrification trend the sensors can be exposed to parasitic magnetic stray fields, and their desired robustness may
Externí odkaz:
https://doaj.org/article/ef1ff38c89624d7e8810d91a7df1c626
Autor:
Jan-Willem Burssens, Christian Schott, G.F. Close, Olivier Dubrulle, Nicolas Dupré, Samuel Huber
Publikováno v:
Proceedings, Vol 2, Iss 13, p 763 (2018)
This paper experimentally demonstrates the stray-field robustness capability of a novel Hall-based rotary position sensor concept (Huber, S., et al, 2018). The sensor targets safety-related automotive applications, for example powertrain and power st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::869246d9230d00bcb61b7c7a7cc41fde
https://www.mdpi.com/2504-3900/2/13/763
https://www.mdpi.com/2504-3900/2/13/763
Autor:
Appo van der Wiel, Tessa ten Cate, Bart van de Vorst, Jan-Willem Burssens, Anton Aulbers, Freddie Furrer, Ben van der Zon, Jian Chen, Hessel Maalderink, Mark Vaes
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Packaging of semiconductor chips, especially MEMS-based, always causes stress on the functional areas of the die causing unpredictable changes in chip performance. As a consequence such devices can only be calibrated individually after complete assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a14307a4986cdc8f75ebb29aaff2d93a
https://doi.org/10.1109/estc.2012.6542066
https://doi.org/10.1109/estc.2012.6542066