Low temperature fusion wafer bonding quality investigation for failure mode analysis

Autor: Christian Patzig, Jens Beyersdorfer, Joerg Siegert, Franz Schrank, Matthias Petzold, Viorel Dragoi, Jan-Paul Krugers, Peter Czurratis, Sebastian Brand

Publikováno v: 12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications-ECS Fall 2012 Meeting, 7 October 2012 through 12 October 2012, Honolulu, HI, 7, 50, 227-239

In this paper, a brief summary of potential defect formation and failure characteristics for low temperature plasma-assisted Si wafer bonding in correlation to different influencing factors is given. In terms of a failure catalogue classification, th

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