Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Jan Wrege"'
Autor:
Benedikt Christopher Wolz, Christian Jaremenko, Florian Vollnhals, Lasse Kling, Jan Wrege, Silke Christiansen
Publikováno v:
Engineering Reports, Vol 4, Iss 12, Pp n/a-n/a (2022)
Abstract Through silicon vias (TSVs) are a key enabling technology for interconnection and realization of complex three‐dimensional integrated circuit (3D‐IC) components. In order to perform failure analysis without the need of destructive sample
Externí odkaz:
https://doaj.org/article/a8040407a86c43aa815b7f5b1b36e3e7
Publikováno v:
Assembly Automation. 27:65-73
PurposeUntil now, the size range of most machines for precision assembly was much larger than the size of the pieces to be handled or the necessary workspace. Flexibly scalable miniaturised production machines can help to develop much more flexible m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e21e1b0138731471a60bf2b5efa30707
https://doi.org/10.1108/01445150710724720
https://doi.org/10.1108/01445150710724720
Publikováno v:
CIRP Annals. 56:45-48
The handling of micro parts made of dielectric material can be affected by electrostatic forces. This work presents new handling devices taking advantage of electrostatic forces. These forces are generated by simple configurations of electrodes or by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5d32727bdeec0a6ad3f0506546dd8a3
https://doi.org/10.1016/j.cirp.2007.05.013
https://doi.org/10.1016/j.cirp.2007.05.013
Autor:
Stefan Böhm, Klaus Dilger, Gregor Hemken, Jan Wrege, W. Ma, Sven Rathmann, Elisabeth Stammen, Juergen Hesselbach
Publikováno v:
Microsystem Technologies. 12:676-679
The new subproject B8 “Adhesive processing in batch technology for the manufacturing of microsystems” has the goal to compile bases for batchable joining techniques based on adhesive systems. This paper presents an alternative adhesive bonding sy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad65df519b131b143f2114a1656d02d8
https://doi.org/10.1007/s00542-006-0101-7
https://doi.org/10.1007/s00542-006-0101-7
Publikováno v:
Microengineering of Metals and Ceramics
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbc81b3bb871b37252fe8d42df318b33
https://doi.org/10.1002/9783527616732.ch5
https://doi.org/10.1002/9783527616732.ch5
Publikováno v:
Assembly Automation. 24:49-57
This paper presents a concept for a micro‐assembly station and shows different possibilities for increasing the positioning accuracy. The main part of the station consists of a spatial parallel structure with three translational degrees of freedom.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf113b98e037185f0087758182c4a6e5
https://doi.org/10.1108/01445150410517183
https://doi.org/10.1108/01445150410517183
Publikováno v:
Montage in der industriellen Produktion ISBN: 9783642290602
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77992a3b8cf737541f66988f959dc2e1
https://doi.org/10.1007/978-3-642-29061-9_17
https://doi.org/10.1007/978-3-642-29061-9_17
Autor:
S. Bütefisch, Annika Raatz, Stephanus Büttgenbach, Jan Wrege, Juergen Hesselbach, B. Hoxhold, Arne Burisch
Publikováno v:
Design and Manufacturing of Active Microsystems ISBN: 9783642129025
In the last several years many improvements of tools for handling and assembling of microparts (between 10 and 500 µm) have been made. This chapter will discuss the development and realization of electrostatic microgrippers and magazine structures a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e0fda0c3f442dea9fcbaf0c6ecf743b
https://doi.org/10.1007/978-3-642-12903-2_16
https://doi.org/10.1007/978-3-642-12903-2_16
Publikováno v:
IFIP International Federation for Information Processing ISBN: 0387312765
IPAS
IPAS
To recognize geometric objects of components in assembly processes, in particular of microelectronic or micro system components, nowadays the use of vision systems is preferred. These systems are working very fast but the results depend on ambient co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48b54ee18339427520aa44531359eb77
https://doi.org/10.1007/0-387-31277-3_11
https://doi.org/10.1007/0-387-31277-3_11