Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jan Urminsky"'
Autor:
Milan Maronek, Filip Sugra, Katarina Bartova, Jozef Barta, Mária Dománková, Jan Urminsky, Matej Pasak
Publikováno v:
Metals, Vol 14, Iss 8, p 953 (2024)
The following study examines the impact of temperature on the deposition of components using Cold Metal Transfer–Wire Arc Additive Manufacturing technology. In the experiment, two overlay weld wall structures were created by applying an interpass t
Externí odkaz:
https://doaj.org/article/3609b28e75ac4beb95f7d63f39dfc078
Publikováno v:
Acta Polytechnica, Vol 56, Iss 1, Pp 76-80 (2016)
This paper presents an analysis of weld joint deformation using optical 3D scanning. The weld joints of bimetals were made by explosion welding (EXW). GOM ATOS II TripleScan SO MV320 equipment with measuring volume 320 × 240 × 240 mm, 5.0 MPix came
Externí odkaz:
https://doaj.org/article/d679b91c6bb14ace8586e01e395f769b
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9783030904203
Lecture Notes in Mechanical Engineering
Lecture Notes in Mechanical Engineering
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6487b720427fac8944b608d2e17dafa6
https://doi.org/10.1007/978-3-030-90421-0_44
https://doi.org/10.1007/978-3-030-90421-0_44
Autor:
Roman Kolenak, Igor Kostolny, Jaromir Drapala, Jan Urminsky, Alexej Pluhar, Paulina Babincova, Daniel Drimal
Publikováno v:
Materials; Volume 15; Issue 15; Pages: 5301
The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effec
Publikováno v:
Acta Polytechnica, Vol 56, Iss 1, Pp 76-80 (2016)
This paper presents an analysis of weld joint deformation using optical 3D scanning. The weld joints of bimetals were made by explosion welding (EXW). GOM ATOS II TripleScan SO MV320 equipment with measuring volume 320 × 240 × 240 mm, 5.0 MPix came
Publikováno v:
Metals, Vol 8, Iss 4, p 274 (2018)
The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid
Externí odkaz:
https://doaj.org/article/060a5baa4eed453ca72e8ec056f56c74