Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Jan Schischka"'
Autor:
Teruo Haibara, Takashi Yamada, Robert Klengel, Noritoshi Araki, Jan Schischka, Motoki Eto, Sandy Klengel
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Silver (Ag) bonding wires are mainly used in consumer products as a reliable low-cost alternative to gold (Au) bonding wires. In automotive applications, the materials are exposed to particularly harsh environmental conditions. In order to understand
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1319e2f176c1888100a8eaefd2845d72
https://doi.org/10.23919/empc53418.2021.9584956
https://doi.org/10.23919/empc53418.2021.9584956
Autor:
Robert Klengel, Takashi Yamada, Tino Stephan, Motoki Eto, Jan Schischka, Sandy Klengel, Matthias Petzold, Noritoshi Araki
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
During the past ten years, copper (Cu) bond wires have extensively replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad718207d903011adb762fed7d08def
https://doi.org/10.1109/ectc32862.2020.00127
https://doi.org/10.1109/ectc32862.2020.00127
Autor:
Tino Stephan, Jan Schischka, Robert Klengel, Noritoshi Araki, Sandy Klengel, Matthias Petzold, Motoki Eto, Takashi Yamada
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
We present studies for a newly developed gold-palladium coated copper wire with focus to the automotive industry. This wire material was designed to prevent halide induced interface corrosion and also sulphur induced pitting corrosion. The base mater
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0babcc02aad4b63c08abe66fe077767
https://doi.org/10.23919/empc44848.2019.8951812
https://doi.org/10.23919/empc44848.2019.8951812
Autor:
Robert Klengel, Jan Schischka, Tino Stephan, Matthias Petzold, Takashi Yamada, Sandy Klengel, Motoki Eto, Noritoshi Araki
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this paper, we present studies for the new gold-palladium coated copper wire "EX1R" with focus to application in the automotive industry. This wire material was developed to prevent halide induced interface corrosion and also sulfur induced pittin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::143eb2c2033a2b44a70f14f6164fecbd
https://doi.org/10.1109/ectc.2019.00034
https://doi.org/10.1109/ectc.2019.00034
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Wire bonding is still the dominating technology for realizing the first level contact of semiconductors. In the last decades miniaturization and increasing connection density resulted in new challenges in terms of reliability and long term stability.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b1ba70850fd4b241a262f26a52324a6
https://doi.org/10.1109/ectc.2016.368
https://doi.org/10.1109/ectc.2016.368
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Failure analysis and material characterization for power electronics packaging is critical, yet extremely challenging due to the large variety of technologies and materials employed. The current paper presents two case studies describing how defects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85df75096b1825b35e2f78434d7d48df
https://doi.org/10.1109/ectc.2016.211
https://doi.org/10.1109/ectc.2016.211
Publikováno v:
Journal of Applied Polymer Science. 114:3774-3779
The mechanical properties of ultrathin electrospun poly(L-lactic acid) (PLLA) fibers were studied by performing tensile tests on individual fibers. The tests were carried out on microelectronic mechanical systems (MEMSs) which were developed for char
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fe22c9be33eb2d61b7d4a0e9a88ee43d
https://doi.org/10.1002/app.30959
https://doi.org/10.1002/app.30959
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d5ff5b5e457f5c6b099d9619e011f13
https://doi.org/10.1109/estc.2014.6962852
https://doi.org/10.1109/estc.2014.6962852
Autor:
Adriana Lapadatu, Tatjana Djuric, Matthias Petzold, Jan Schischka, Sebastian Brand, Peter Czurratis
Current trends in microelectronics focus on three-dimensionally integrating different components to allow for increasing density and functionality of integrated systems. Concepts pursued involve vertical stacking and interconnecting technologies that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ef2cb62b1fda65ada04b605c3445936b
https://publica.fraunhofer.de/handle/publica/236560
https://publica.fraunhofer.de/handle/publica/236560
Autor:
Marc Sentis, Jens Beyersdorfer, Laurens F. Tz. Kwakman, Jan Schischka, Falk Naumann, Marcus Straw, Frank Altmann, Gaëlle Coustillier
Publikováno v:
Scopus-Elsevier
In this paper different sample preparation strategies for fast and efficient failure analysis of 3D devices are reviewed and further explored. It will be shown that a combined workflow using laser ablation and plasma FIB milling provides best flexibi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5079e119b0f25fbcf866c17036904c04
https://doi.org/10.31399/asm.cp.istfa2013p0017
https://doi.org/10.31399/asm.cp.istfa2013p0017