Zobrazeno 1 - 5
of 5
pro vyhledávání: '"James Yamaguchi"'
Autor:
Sung Kyu Lim, Christian Krutzik, Jean Yang-Scharlotta, Anthony Agnesina, John M. Carson, James Yamaguchi
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28:2055-2068
The first mainstream products in three-dimensional integrated circuit (3-D IC) design are memory devices where multiple memory tiers are horizontally integrated to offer manifold improvements when compared with their 2-D counterparts. Unfortunately,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f8fe244c2001709c0766d0c5dbcad10
https://doi.org/10.1109/tvlsi.2020.3002211
https://doi.org/10.1109/tvlsi.2020.3002211
Autor:
Sung Kyu Lim, Da Eun Shim, Christian Krutzik, Anthony Agnesina, John M. Carson, James Yamaguchi, Dan Nakamura
Publikováno v:
ICCD
In this work, we develop a new 3D flash memory cube architecture that integrates multiple flash dies and their logic controller in a unique and optimized fashion for space applications. In our Loaf-of-Bread (LOB) configuration, flash dies are standin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9f8f7ad7085ad751d4366e2df542968
https://doi.org/10.1109/iccd50377.2020.00078
https://doi.org/10.1109/iccd50377.2020.00078
Autor:
James Yamaguchi, Jean Yang-Scharlotta, Anthony Agnesina, Christian Krutzik, John M. Carson, Sung Kyu Lim
Publikováno v:
2019 IEEE Aerospace Conference.
This paper details the architectural choices and implementation challenges faced in the building and validation of a space-qualified 3D DRAM memory system, in an effort to offer high memory capacity, increased bandwidth, fault tolerance and improved
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9820097ccdc95926915d9e1fb1c15fd3
https://doi.org/10.1109/aero.2019.8742015
https://doi.org/10.1109/aero.2019.8742015
Autor:
James Yamaguchi, Volkan H. Ozguz
Publikováno v:
MRS Bulletin. 28:35-40
Advanced three-dimensional (3D) packaging techniques for electronic components are promising for the realization of “systems-in-packages.” Three-dimensional packages require the use of a variety of materials within a small physical size range. Ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d62553b779a91ba67f0431b42e863e7
https://doi.org/10.1557/mrs2003.15
https://doi.org/10.1557/mrs2003.15
Autor:
R. M. Lea, J. C. Carson, I. P. Jalowiecki, James Yamaguchi, D. K. Boughton, A. A. Pepe, V. H. Ozguz
Publikováno v:
IEEE Transactions on Advanced Packaging. 22:424-432
The development and evaluation of a three-dimensional (3-D) interconnect and packaging technology for massively parallel processor (MPP) implementation is reported. Following reviews of specific modular massively parallel computer (MPC) accelerator a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c25e0d6ab13223cbcf39c8a27c354ac
https://doi.org/10.1109/6040.784496
https://doi.org/10.1109/6040.784496