Zobrazeno 1 - 6
of 6
pro vyhledávání: '"James Schlueter"'
Autor:
Anupama Mallikarjunan, Jennifer Achtyl, Rung-Je Yang, Chen-Yuan Huang, Shih-Hsuan Chao, Lu Gan, Robert Ridgeway, James Schlueter, Ming-Shih Tsai, Chris Li, Mark O'Neill
Publikováno v:
ECS Meeting Abstracts. :1032-1032
Low κ Organosilicate Glass (OSG) films are being proliferated into new IC device architectures with CMP requirements spanning a wide range (highly selective to non-selective, low polish rates to high polish rates). This study aims to understand the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e65035e06d074cb00894584d5dcca25
https://doi.org/10.1149/ma2019-01/17/1032
https://doi.org/10.1149/ma2019-01/17/1032
Publikováno v:
MRS Proceedings. 671
MESA is a feature-scale planarization model that predicts the changing topography of the wafer surface during the chemical mechanical polishing (CMP) process used in IC manufacturing. This model has previously been applied to the polish of inter-leve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50dfedba3e26bdf8d98caab5d70c6404
https://doi.org/10.1557/proc-671-m4.2
https://doi.org/10.1557/proc-671-m4.2
Publikováno v:
ECS Meeting Abstracts. :2489-2489
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90a6ae8d87861e768237577e47318250
https://doi.org/10.1149/ma2012-02/29/2489
https://doi.org/10.1149/ma2012-02/29/2489
Publikováno v:
ECS Meeting Abstracts. :2486-2486
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c46bb1c744c93dbe12cb35d5d8e47b7
https://doi.org/10.1149/ma2012-02/29/2486
https://doi.org/10.1149/ma2012-02/29/2486
Publikováno v:
ECS Meeting Abstracts. :2373-2373
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4e7975931555e6e15ce10258235a699
https://doi.org/10.1149/ma2010-02/21/2373
https://doi.org/10.1149/ma2010-02/21/2373
Publikováno v:
MRS Proceedings. 92
Slip is a primary concern in Rapid Thermal Processing (RTP). Diagnostics for slip are compared, including: visual inspection, differential interference contrast microscopy (Nomarski), X-ray topography, decorative etching and optical surface scanning.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24924b7929961dba0f6b9f7034964e26
https://doi.org/10.1557/proc-92-265
https://doi.org/10.1557/proc-92-265