Zobrazeno 1 - 2
of 2
pro vyhledávání: '"James Schaffranek"'
Autor:
Andrew Elliott, James Schaffranek, Matthew Sutter, Mike Strizich, Adam G. Kimura, Glen D. Via, Jon Scholl
Publikováno v:
Journal of Hardware and Systems Security. 4:34-43
This paper reviews a developed integrated circuit (IC) decomposition workflow that can be leveraged for extracting design files and performing advanced verification and validation techniques on fabricated chips. In this work, a commercial 130-nm micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac678ac41e1b3af4330e38085cbddf7f
https://doi.org/10.1007/s41635-019-00086-6
https://doi.org/10.1007/s41635-019-00086-6
Publikováno v:
2020 IEEE Physical Assurance and Inspection of Electronics (PAINE).
This paper reviews the decomposition of a fabricated Serial Peripheral Interface (SPI) that was manufactured in a 130 nm process node technology to establish a verification and validation methodology for baselining microelectronics assurance. The fab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e2df2d520becf265f302921fa56e37a
https://doi.org/10.1109/paine49178.2020.9337733
https://doi.org/10.1109/paine49178.2020.9337733