Zobrazeno 1 - 3
of 3
pro vyhledávání: '"James Patrick Wood"'
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The microelectronics industry continues to witness an ever-increasing movement towards heterogeneous integration leveraging the advantages of 2.5D and 3D/TSV in advanced semiconductor packaging and integration. New processes and physical structures a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0bfe66cda0134e4aa726aa974bd4aa2
https://doi.org/10.1109/ectc.2014.6897509
https://doi.org/10.1109/ectc.2014.6897509
Autor:
B.C. Campbell, E. Laine, Eric D. Perfecto, Luc Guerin, John J. Garant, J. Busby, James Patrick Wood
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
C4NP is a novel solder bumping technology developed by IBM that addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. It is a solder transfer technology where m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83121d72b366db9bd5aa1999ed2c698a
https://doi.org/10.1109/ectc.2007.373966
https://doi.org/10.1109/ectc.2007.373966
Autor:
Gary L. Gilliland, James Patrick Wood, Barry C. Finzel, Michael W. Pantoliano, Michele L. Rollence, Philip N. Brayan, Thomas L. Poulos, Andrew Howard
Publikováno v:
Proteins: Structure, Function, and Genetics. 1:326-334
A procedure has been developed for the isolation and identification of mutants in the bacterial serine protease subtilisin that exhibit enhanced thermal stability. The cloned subtilisin BPN' gene from Bacillus amyloliquefaciens was treated with bisul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8bdef516296d7873a99876351aacad57
https://doi.org/10.1002/prot.340010406
https://doi.org/10.1002/prot.340010406