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pro vyhledávání: '"James Matthew Henry"'
Publikováno v:
ECS Transactions. 50:17-27
Currently, the manufacture of integrated circuits and fabrication of electronic devices requires the use of various types of chemical mechanical polishing compositions to selectively remove different metal, barrier, dielectric, low-k, ultra-low-k and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2ffd338b070a20c25efe40719fd4bb5
https://doi.org/10.1149/05039.0017ecst
https://doi.org/10.1149/05039.0017ecst
