Zobrazeno 1 - 10
of 62
pro vyhledávání: '"James M. Blackwell"'
Publikováno v:
Antiviral therapy. 27(6)
Background Direct-acting antivirals (DAAs) have revolutionized treatment for HCV. Compared to interferon-based therapies, DAAs achieve higher rates of sustained virologic response, with more tolerable side effects. Nonetheless, interferon-based thera
Autor:
Michael J. Eller, Jander Cruz, Stanislav V. Verkhoturov, Michael A. Robinson, James M. Blackwell, Emile A. Schweikert
Publikováno v:
Journal of Micro/Nanopatterning, Materials, and Metrology. 21
Autor:
Michael J. Eller, Jander Cruz, Stanislav V. Verkhoturov, Michael A. Robinson, James M. Blackwell, Emile A. Schweikert
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2022.
Autor:
Jander Cruz, Stanislav V. Verkhoturov, Dmitriy S. Verkhoturov, Michael A. Robinson, James M. Blackwell, Michael J. Eller, Emile A. Schweikert
Publikováno v:
Journal of Micro/Nanopatterning, Materials, and Metrology. 21
Autor:
Jander Cruz, Michael J. Eller, Stanislav V. Verkhoturov, Dmitriy S. Verkhoturov, Michael A. Robinson, James M. Blackwell, Emile A. Schweikert
Publikováno v:
Advances in Patterning Materials and Processes XXXIX.
Autor:
Michael J. Eller, Jander Cruz, Stanislav V. Verkhorurov, Michael A. Robinson, James M. Blackwell, Emile A. Schweikert
Publikováno v:
Advances in Patterning Materials and Processes XXXIX.
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2021.
New resists are needed to advance EUV lithography. Tailored design of efficient photoresist is impossible without fundamental understanding of EUV induced chemistry. The absorption of an EUV photon by a thin film resist leads to emission of primary a
Autor:
Matthew V. Metz, James S. Clarke, Mauro J. Kobrinsky, J. Bielefeld, Ramanan V. Chebiam, Marius K. Orlowski, Sean W. King, Carl H. Naylor, S. Vyas, John J. Plombon, R. Thapa, Vamseedhara Vemuri, James M. Blackwell, Ye Fan, David J. Michalak, Florian Gstrein, Nicholas C. Strandwitz, Michelle M. Paquette
Publikováno v:
2020 IEEE International Electron Devices Meeting (IEDM).
The remarkable advancement of CMOS electronics over the past two decades has been greatly aided by innovations allowing dielectric scaling across both ends of the permittivity spectrum. This paper describes how new dielectric innovations beyond permi
Publikováno v:
Extreme Ultraviolet (EUV) Lithography XI.
Despite years of research and development, the fundamental processes of photoionization, secondary electron generation, recombination, diffusion, and resist switching are poorly understood at the atomic level for EUVL. Multiscale modeling of these ph
Autor:
Lauren E. Kreno, David J. Michalak, Arkaprabha Sengupta, James M. Blackwell, James S. Clarke, Jessica M. Torres, Daniel Pantuso
Publikováno v:
Journal of Materials Research. 30:3363-3385
Reducing the delay of backend interconnects is critical in delivering improved performance in next generation computer chips. One option is to implement interlayer dielectric (ILD) materials with increasingly lower dielectric constant (k) values. Des