Zobrazeno 1 - 4
of 4
pro vyhledávání: '"James Gouker"'
Publikováno v:
International Symposium on Microelectronics. 2012:000781-000784
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2081a4478dc3eaa3b2c1a44ec4cf83e8
https://doi.org/10.4071/isom-2012-wp14
https://doi.org/10.4071/isom-2012-wp14
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000791-000810
Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa5e441bc2a92008fe393395be703fef
https://doi.org/10.4071/2012dpc-tp12
https://doi.org/10.4071/2012dpc-tp12
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001269-001290
The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a61a950cff64fb3ce523d642934ca16
https://doi.org/10.4071/2011dpc-wa12
https://doi.org/10.4071/2011dpc-wa12
Publikováno v:
International Symposium on Microelectronics. 2011:000199-000201
The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46bbb2663d7e695730cb95f5ecb1e99b
https://doi.org/10.4071/isom-2011-tp1-paper3
https://doi.org/10.4071/isom-2011-tp1-paper3