Zobrazeno 1 - 3
of 3
pro vyhledávání: '"James E. Drye"'
Publikováno v:
The Journal of Adhesion. 40:257-265
This paper discusses a new method of evaluating thin film adhesion both qualitatively and quantitatively via a combination of peeling and image processing techniques. The adhesion of thin film on the entire substrate can be quickly evaluated and quan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f9c4571311ceb67e0cc90d9b9714e80
https://doi.org/10.1080/00218469308031288
https://doi.org/10.1080/00218469308031288
Publikováno v:
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
An RF switch made using MEMS (Micro Electro-Mechanical System) technology shows attractive electrical characteristics that are critically needed in the next generation low power consumption, high data rate RF wireless systems. In order to provide env
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abd99dc12a51946d71b7d4e4007ecdd8
https://doi.org/10.1109/ectc.2002.1008229
https://doi.org/10.1109/ectc.2002.1008229
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
Conductive polymer bonded flip chip interconnect systems can provide an attractive alternative flip chip technology in terms of cost and manufacturability. This work examines the feasibility of application of such a technology. A mathematical model f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d892e6d2e8bbdf345dd608cc4ef7ada0
https://doi.org/10.1109/ectc.1996.550813
https://doi.org/10.1109/ectc.1996.550813