Zobrazeno 1 - 10
of 38
pro vyhledávání: '"James Christian Salvia"'
Autor:
Vu A. Hong, Eldwin J. Ng, Andrew B. Graham, James Christian Salvia, Thomas W. Kenny, M.W. Messana, Todd T. Branchflower, S. Yoneoka
Publikováno v:
Journal of Microelectromechanical Systems. 24:351-359
The fatigue lifetime of single crystal silicon (SCS) was characterized in an environment free of oxygen, humidity, and organics. Long-term ( $> 10^{10}$ Hz) fatigue experiments performed with smooth-walled SCS devices showed no signs of fatigue damag
Autor:
Sassan Tabatabaei, Pavan Gupta, Michael H. Perrott, Carl Arft, Jintae Kim, Sudhakar Pamarti, Aaron Partridge, Hae-Chang Lee, Fred Lee, Shouvik Mukherjee, Fari Assaderaghi, Niveditha Arumugam, James Christian Salvia
Publikováno v:
IEEE Journal of Solid-State Circuits. 48:276-291
MEMS-based oscillators offer a silicon-based alternative to quartz-based frequency references. Here, a MEMS-based programmable oscillator is presented which achieves better than ±0.5-ppm frequency stability from -40°C to 85°C and less than 1-ps (r
Autor:
Thomas W. Kenny, Bongsang Kim, James Christian Salvia, Renata Melamud, Hyung Kyu Lee, Matthew A. Hopcroft
Publikováno v:
Journal of Microelectromechanical Systems. 20:1355-1365
Electrostatic tuning of the frequency in micromachined Si-SiO2 composite resonators for temperature compensation is demonstrated and analyzed. Electrostatic tuning exploits the bias voltage dependence of frequency for the compensation. Si-SiO2 compos
Autor:
Gaurav Bahl, James Christian Salvia, Thomas W. Kenny, Roger T. Howe, Bongsang Kim, Renata Melamud
Publikováno v:
Journal of Microelectromechanical Systems. 20:355-364
This paper proposes the use of ac polarization for resonant electrostatic microelectromechanical systems that eliminates the frequency drift caused by dielectric charging and charge screening. It is mathematically and experimentally shown that an ac-
Autor:
Renata Melamud, Thomas W. Kenny, Shasha Wang, Kuan-Lin Chen, James Christian Salvia, Roger T. Howe
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:310-317
This paper presents an integrated solution for wafer-level packaging and electrostatic actuation of out-of-plane radio frequency microelectromechanical system resonators. By integrating the electrodes into the epitaxial-grown silicon layer, both the
Autor:
Roger T. Howe, R.G. Hennessy, Gaurav Bahl, Bongsang Kim, David Elata, Rob N. Candler, Matthew A. Hopcroft, Thomas W. Kenny, Saurabh A. Chandorkar, James Christian Salvia, Renata Melamud
Publikováno v:
Journal of Microelectromechanical Systems. 19:162-174
This paper investigates the effects of dielectric charge on resonant frequency in thermally oxidized silicon resonators hermetically encapsulated using ?epi-seal.? SiO2 coatings are effective for passive temperature compensation of resonators but mak
Publikováno v:
Journal of Microelectromechanical Systems. 19:192-201
We present a new temperature compensation system for microresonator-based frequency references. It consists of a phase-locked loop (PLL) whose inputs are derived from two microresonators with different temperature coefficients of frequency. The reson
Autor:
Renata Melamud, Bongsang Kim, Thomas W. Kenny, Hyung Kyu Lee, Saurabh A. Chandorkar, Gaurav Bahl, Matthew A. Hopcroft, James Christian Salvia
Publikováno v:
Journal of Microelectromechanical Systems. 18:1409-1419
Utilizing silicon and silicon dioxide's opposing temperature coefficients of Young's modulus, composite resonators with zero linear temperature coefficient of frequency are fabricated and characterized. The resulting resonators have a quadratic tempe
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:402-409
This paper aims to demonstrate the utility of silicon interconnects for radio-frequency (RF) microelectromechanical system (MEMS) devices that are packaged using a wafer-scale encapsulation process. Design and fabrication steps for the packaged inter
Autor:
Rob N. Candler, James Christian Salvia, Saurabh A. Chandorkar, Thomas W. Kenny, Manu Agarwal, Bongsang Kim, Matthew A. Hopcroft, Renata Melamud, C.M. Jha
Publikováno v:
Journal of Microelectromechanical Systems. 17:175-184
This paper presents an in-chip thermal-isolation technique for a micro-ovenized microelectromechanical-system resonator. Resonators with a microoven can be used for high-precision feedback control of temperature to compensate for the temperature depe