Zobrazeno 1 - 10
of 45
pro vyhledávání: '"James Christofferson"'
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 32:447-452
We present high-resolution thermal images of the electrical contacts inside an active thermoelectric micromodule that are acquired through the silicon substrate using near-infrared thermoreflectance. The temperature distribution of the contacts induc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9a8d6529559fb1b5a56a4b7f142a190
https://doi.org/10.1109/tcapt.2008.2011886
https://doi.org/10.1109/tcapt.2008.2011886
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:395-401
In this paper, we addressed heating problems in integrated circuits (ICs) and proposed a thin-film thermionic cooling solution using Si/SiGe superlattice microrefrigerators. We compared our technology with the current most common solution, thermoelec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::331d69dac1487b124e1cb3f3d94f0e40
https://doi.org/10.1109/tcapt.2006.875884
https://doi.org/10.1109/tcapt.2006.875884
Autor:
Ali Shakouri, Yiying Wu, Deyu Li, Peidong Yang, Rong Fan, Yan Zhang, A. Majumdar, James Christofferson
Publikováno v:
IEEE Transactions On Nanotechnology. 5:67-74
We studied heat transfer along a silicon nanowire suspended between two thin-film heaters using a thermoreflectance imaging technique. The thermoreflectance imaging system achieved submicrometer spatial resolution and 0.1/spl deg/C temperature resolu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7ebd25b9c97048cea730960401c311e
https://doi.org/10.1109/tnano.2005.861769
https://doi.org/10.1109/tnano.2005.861769
Autor:
Clint L. Schow, T. A. Strand, Ping Koh, Zhixi Bian, Ali Shakouri, Gregory Fish, Y.A. Akulova, P. Kozodoy, James Christofferson
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:651-657
We investigate thermal effects in widely-tunable laser transmitters based on an integrated single chip design. The chip contains a Sampled-Grating Distributed Bragg Reflector (SG-DBR) laser monolithically integrated with a semiconductor optical ampli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e544c363d19b86fcf158664c880cd816
https://doi.org/10.1109/tcapt.2005.859736
https://doi.org/10.1109/tcapt.2005.859736
Autor:
Edward T. Croke, Xiaofeng Fan, Yan Zhang, Chris LaBounty, Gehong Zeng, Ali Shakouri, Daryoosh Vashaee, James Christofferson, John E. Bowers, Joachim Piprek
Publikováno v:
Microscale Thermophysical Engineering. 9:99-118
Modeling and optimization of bulk SiGe thin-film coolers are described. Thin-film coolers can provide large cooling power densities compared to commercial thermoelectrics. Thin-film SiGe coolers have been demonstrated with maximum cooling of 4°C at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9279f3512871e88e5f08155d82044c46
https://doi.org/10.1080/10893950590913459
https://doi.org/10.1080/10893950590913459
Autor:
Ali Shakouri, James Christofferson
Publikováno v:
Microelectronics Journal. 35:791-796
Modern, high-density integrated circuits (IC) typically use a flip chip bonding technique to increase performance on a greater number of interconnects. In doing so, the active devices of the IC are hidden under the exposed substrate, which precludes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38eb20939387efabffec7475443532df
https://doi.org/10.1016/j.mejo.2004.06.009
https://doi.org/10.1016/j.mejo.2004.06.009
Publikováno v:
Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems.
Thermal characterization is useful for identifying the cause of circuit failures. Unusually high local temperatures can occur due to unexpected and localized power dissipation in a particular device, which was not anticipated nor designed in the devi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9ace77a71db534b9d09b0b3ff50c863
https://doi.org/10.1115/ipack2013-73104
https://doi.org/10.1115/ipack2013-73104
Publikováno v:
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
This study shows the results of a transient and steady-state thermal imaging, using an infrared (IR) imaging system and thermoreflectance (TR) imaging for comparison. The experiments, carried out on a wire-bond package and a flip-chip package of a CM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7da5d8d3ba0591f3d1e2fe5cfe288f8c
https://doi.org/10.1109/itherm.2012.6231584
https://doi.org/10.1109/itherm.2012.6231584
Publikováno v:
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Microelectronic integrated circuits experience nonuniform high temperatures during normal operation. Thermal expansion mismatch among the different materials comprising the device lead to a large tensile stress after high temperature cycles. Voiding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcbbe14c0a75af4db7710d2ca39620bc
https://doi.org/10.1109/stherm.2011.5767172
https://doi.org/10.1109/stherm.2011.5767172
Publikováno v:
MRS Proceedings. 1329
Over the past few years, thermoelectric (TE) materials have been receiving an increasing amount of attention owing to their promising potential for energy conversion and thermal management applications. Thermal characterisation techniques offer a pow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::077483104943a9ecd421f1c7d2237710
https://doi.org/10.1557/opl.2011.1232
https://doi.org/10.1557/opl.2011.1232