Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Jaimal Williamson"'
Publikováno v:
IMAPSource Proceedings. 2022
Board level reliability (BLR) temperature cycling is a metric for FCBGA field performance, where it is imperative to understand process variation holistically covering both substrate and / or assembly manufacturing process and its impact to product m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95981dece4133b10aaa841ee98af86e5
https://doi.org/10.4071/001c.74773
https://doi.org/10.4071/001c.74773
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Modern computing platforms used in data centers or harsh environment platforms would be exposed to sustained high temperatures over an extended period of time. Thermal interface materials are extensively used to transport heat from the die surfaces t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::458eba49aa07727a6d6b3f356a0655da
https://doi.org/10.1115/ipack2022-97440
https://doi.org/10.1115/ipack2022-97440
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Underhood applications in automotive are increasingly using electronics systems for safety and critical functions. In flip-chip ball grid array (FCBGA) packages, underfill (UF) forms the integral mechanical support between the substrate and die. In a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab86e0d4c97bfd86322f3a309538be29
https://doi.org/10.1115/ipack2022-97424
https://doi.org/10.1115/ipack2022-97424
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:589-597
In modern integrated circuit (IC) packaging, it is difficult to perceive and evaluate the quality of the solder ball interconnections due to their complex hidden physical configuration and miniaturization. Laser ultrasonic inspection (LUI) technique
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15720d53f3b3b49a97388430e02f20f6
https://doi.org/10.1109/tcpmt.2021.3065958
https://doi.org/10.1109/tcpmt.2021.3065958
Autor:
Jaimal Williamson, Jeffrey C. Suhling, Yunli Zhang, Edward W. Davis, Pradeep Lall, Haotian Wu
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Much of the electronics used to support power systems and enable safety systems resides underhood where operating temperatures are much higher than in traditional consumer applications. Underhood electronics may be subjected to sustained high tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::432eaadcf46b1bc6780f46c838ee38e0
https://doi.org/10.1115/ipack2021-74075
https://doi.org/10.1115/ipack2021-74075
Publikováno v:
Journal of Electronic Packaging. 144
Laser ultrasonic inspection (LUI) is a nondestructive and noncontact technique to evaluate the quality of solder ball interconnections in area-array micro-electronic packages. Dual-Fiber Array Laser Ultrasonic Inspection System was demonstrated ident
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3eb738f5aa8550db4fa7045a96df8d59
https://doi.org/10.1115/1.4050898
https://doi.org/10.1115/1.4050898
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b44d0af6ac1d05ac913761c112288ed3
https://doi.org/10.1109/itherm51669.2021.9503189
https://doi.org/10.1109/itherm51669.2021.9503189
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Thermo-mechanical reliability of Flip Chip Ball Grid Arrays in automotive underhood environments has received a lot of attention owing the emergence of new application in advanced driver assist systems including guidance, navigation and control. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::874759ef0ee8f2812a1ae53eb499507a
https://doi.org/10.1109/itherm51669.2021.9503234
https://doi.org/10.1109/itherm51669.2021.9503234
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
FCBGAs are finding applications in automotive underhood environments where they may be subjected to sustained temperatures of 125-200°C for sustained periods during operation. While, FCGBAs have been previously used in consumer applications where op
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b629cbd839643aa04d1e4491cad58c77
https://doi.org/10.1109/itherm51669.2021.9503197
https://doi.org/10.1109/itherm51669.2021.9503197
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Flip-Chip Ball Grid Arrays (FCBGAs) are finding applications in automotive underhood electronics for enablement of safety-critical functions. Underfills needed to reinforce flip-chip interconnects in FCBGAs need to operate reliably under sustained hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caa4b5e1614971ba288a6e7cd82c8587
https://doi.org/10.1115/ipack2020-2676
https://doi.org/10.1115/ipack2020-2676