Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Jaenam Kim"'
Autor:
Jaenam Kim, Joo-Hyoung Kim, Yun-Tzu Chang, Jihoon Park, Minhyun Jin, Vladimir Pejović, Epimitheas Georgitzikis, Steven Thijs, Itai Lieberman, Yunlong Li, Paul Heremans, Paweł Malinowski, Jung-Hoon Chun, Jiwon Lee
Publikováno v:
IEEE Transactions on Electron Devices. 70:3155-3159
Publikováno v:
IEEE Solid-State Circuits Letters. 6:141-144
Autor:
Joo Hyoung Kim, Vladimir Pejovic, Epimitheas Georgitzikis, Yunlong Li, Jaenam Kim, Pawel E. Malinowski, Itai Lieberman, David Cheyns, Paul Heremans, Jiwon Lee
Publikováno v:
IEEE Transactions on Electron Devices. 69:2900-2906
Publikováno v:
2016 IEEE International Conference on Plasma Science (ICOPS).
Atmospheric microwave-induced plasma sources have been favored for industrial material processing and decontamination applications due to their many advantages of inexpensiveness, simplicity and easiness of operation1–3. High power waterload with a
Autor:
Zhang, Ziyue1,2 (AUTHOR) chengxuequn@ustb.edu.cn, Zhang, Jie2 (AUTHOR) 15810531277@163.com, Zhao, Xingyuan2 (AUTHOR), Cheng, Xuequn1 (AUTHOR), Liu, Xin2 (AUTHOR), Zhang, Qifu2 (AUTHOR)
Publikováno v:
Materials (1996-1944). Jun2024, Vol. 17 Issue 11, p2719. 13p.
Publikováno v:
EUC (2)
The energy of a sensor network decides how long it will be alive. Therefore, energy efficiency is the critical part of network survivability. The most energy-consuming action of a sensor network is considered as communication between nodes. For energ
Publikováno v:
Journal of Aerospace Engineering; Sep2015, Vol. 28 Issue 5, p1-15, 15p
Publikováno v:
2008 IEEE/IFIP International Conference on Embedded & Ubiquitous Computing; 2008, p676-681, 6p
Autor:
Zhang, Ziyue, Zhang, Jie, Zhao, Xingyuan, Liu, Xin, Cheng, Xuequn, Jiang, Sheming, Zhang, Qifu
Publikováno v:
Metals (2075-4701); Dec2023, Vol. 13 Issue 12, p1963, 13p
Autor:
Kim, Joo Hyoung, Pejovic, Vladimir, Georgitzikis, Epimitheas, Li, Yunlong, Kim, Jaenam, Malinowski, Pawel E., Lieberman, Itai, Cheyns, David, Heremans, Paul, Lee, Jiwon
Publikováno v:
IEEE Transactions on Electron Devices; Jun2022, Vol. 69 Issue 6, p2900-2906, 7p