Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Jaehyeong Woo"'
Publikováno v:
Journal of The Korean Society of Agricultural Engineers. 57:141-152
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper describes the failure analysis methods used to characterize micro cracks that resulted in laser vias of printed circuit boards (PCBs) through case studies of destructive failure analysis. Defects such as cracks in laser vias of PCBs can ca