Zobrazeno 1 - 4
of 4
pro vyhledávání: '"JaeMyong Kim"'
Autor:
Michael Liu, Jenn An Wang, JaeMyong Kim, Jae-Pil Kim, Anthony D. Yang, OhYoung Kwon, YongHyuk Jeong, Eric Yang, Eric Ouyang, Susan Lin
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing parameters and processes [1], [2]. Previous research
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::276c07245f6c78eff37c43dc1b660e74
https://doi.org/10.1109/ectc32696.2021.00335
https://doi.org/10.1109/ectc32696.2021.00335
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The current trends of consumer electronics are to make the devices smaller, faster, better performance, and have more functions. To meet these requirements, semiconductor packaging is moving toward system-in-package (SiP) which is to pack a number of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69f0751c17cb45007f26fe8030730cab
https://doi.org/10.1109/ectc32862.2020.00320
https://doi.org/10.1109/ectc32862.2020.00320
Autor:
Anthony D. Yang, Jim Hsu, Eric Ouyang, YongHyuk Jeong, SeonMo Gu, JaeMyong Kim, Susan Lin, Billy Ahn, Goran Liu
Publikováno v:
International Symposium on Microelectronics. 2018:000344-000348
In this paper, the impact of two different types of warpage, strip warpage and system-in-packages (SiP) module warpage, are considered and studied, both experimentally and numerically. An advanced material characterization method is also conducted to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abbd7a25b8b9cdce76a88f20f745b43a
https://doi.org/10.4071/2380-4505-2018.1.000344
https://doi.org/10.4071/2380-4505-2018.1.000344
Autor:
Eric Ouyang, Billy Ahn, SeonMo Gu, Seng Guan Chow, Anonuevo Dexter, YongHyuk Jeong, JaeMyong Kim
Publikováno v:
International Symposium on Microelectronics. 2016:000498-000503
To lower the manufacturing cost of quad flat no-lead (QFN) packages, the number of QFN packages on a leadframe must be increased. However, the increased number of packages or changes to the layout of QFN packages on the leadframe can impact the mold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::078b1ab0a608a456774d66332fc59725
https://doi.org/10.4071/isom-2016-tha51
https://doi.org/10.4071/isom-2016-tha51