Zobrazeno 1 - 6
of 6
pro vyhledávání: '"JaeHun Bae"'
Publikováno v:
Journal of Functional Foods, Vol 63, Iss , Pp - (2019)
The prevalence of inflammatory bowel disease (IBD) is increasing worldwide, and the key risk factor is high sugar diet. The objective of this study was to investigate anti-inflammatory effects of turanose on IBD in a dextran sulfate sodium (DSS)-indu
Externí odkaz:
https://doaj.org/article/b1da027accb741309e0c998ba123e869
Publikováno v:
New Biotechnology. 70:1-8
The aim of this study was to establish an efficient bioprocess for the synthesis of trehalulose as a novel sweetener. This disaccharide has 70% of the sweetness of sucrose and bioactive properties such as anti-cariogenicity and anti-oxidizing activit
Autor:
GyuIck Jung, SooHyun Kim, HoDol Yoo, WonChul Do, TaeKyeong Hwang, WonMyoung Ki, JaeHun Bae, InSu Mok, SeungMan Ryu
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution
Autor:
KiYeul Yang, Nathan Whitchurch, Michael G. Kelly, Curtis Zwenger, George J. Scott, TaeKyeong Hwang, WonMyoung Ki, JongHyun Jeon, JaeHun Bae
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packag
Publikováno v:
Journal of Functional Foods, Vol 63, Iss, Pp-(2019)
The prevalence of inflammatory bowel disease (IBD) is increasing worldwide, and the key risk factor is high sugar diet. The objective of this study was to investigate anti-inflammatory effects of turanose on IBD in a dextran sulfate sodium (DSS)-indu
Autor:
David Jon Hiner, Michael G. Kelly, WonChul Do, SangEun Park, Ji Hyun Kim, MinHwa Chang, AhRa Jo, Youngrae Kim, JaeHun Bae
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
A novel HD-FO package platform was introduced with a hybrid RDL structure. An HD-FO package with hybrid RDL could enables higher routing density and multi die construction in a planner configuration. The 1-µm and submicron RDL wafers were fabricated