Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Jae-ouk Choo"'
Publikováno v:
AIChE Journal. 51:572-584
Most conventional chemical vapor deposition (CVD) systems do not have the spatial actuation and sensing capabilities necessary to control deposition uniformity, or to intentionally induce nonuniform deposition patterns for single-wafer combinatorial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e86d6e539199b36bdd07250b85a75a39
https://doi.org/10.1002/aic.10358
https://doi.org/10.1002/aic.10358
Publikováno v:
IFAC Proceedings Volumes. 37:559-564
Most conventional chemical vapor deposition systems do not have the spatial actuation and sensing capabilities necessary to control deposition uniformity, or to intentionally induce nonuniform deposition patterns for single-wafer combinatorial CVD ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10b920fe74b6bab6cb5e3bd911729976
https://doi.org/10.1016/s1474-6670(17)38791-8
https://doi.org/10.1016/s1474-6670(17)38791-8
Publikováno v:
Korean Journal of Chemical Engineering. 15:90-94
Modeling and simulation for a sulfolane extraction process were performed. The process investigated in the present work consists of two tray columns, one of which is used for extraction and the other one for washing. The modified θ-method was employ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::819366df70d05549abdde83aac21d37c
https://doi.org/10.1007/bf02705311
https://doi.org/10.1007/bf02705311
Autor:
Nae In Lee, Jung-Shik Heo, Kyoung-Woo Lee, Seung-Jin Lee, Jae-Hak Kim, Jae-ouk Choo, S. W. Nam, Hong Jae Shin, Seung Man Choi, Keeyoung Jun, Woon Hyuk Choi, Young Jin Wee, Andrew-tae Kim, Jae Yeol Maeng, Lee Jungeun
Publikováno v:
2007 IEEE International Interconnect Technology Conferencee.
The root cause and an approach to lifetime expectation of bi-modal distribution in Cu/low-k interconnect have been elucidated through experimental and simulation results. The early mode with short failure time and voids at via bottom interface, could
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5907245d224b4ff5faca7441710ecd0
https://doi.org/10.1109/iitc.2007.382343
https://doi.org/10.1109/iitc.2007.382343
Publikováno v:
Proceedings of the 2004 American Control Conference.
This work describes the continuing design evolution of a new approach to spatially controllable chemical vapor deposition for electronic materials manufacturing. Based on the success of a previous prototype reactor, we describe construction of a newe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b2afc15229cdb2dd149e92c6c319923
https://doi.org/10.23919/acc.2004.1383619
https://doi.org/10.23919/acc.2004.1383619
Autor:
Yuhong Cai, Raymond A. Adomaitis, Gary W. Rubloff, Ramaswamy Sreenivasan, Laurent Henn-Lecordier, Jae-ouk Choo
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 25:1288
Mass spectrometry has proven valuable in understanding and controlling chemical processes used in semiconductor fabrication. Given the complexity of spatial distributions of fluid flow, thermal, and chemical parameters in such processes, multipoint c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68bd1d18e11b8ae436eb9caf3e131972
https://doi.org/10.1116/1.2753851
https://doi.org/10.1116/1.2753851
Publikováno v:
Review of Scientific Instruments. 76:062217
Most conventional chemical vapor deposition (CVD) systems do not have the spatial actuation and sensing capabilities necessary to control deposition uniformity or to intentionally induce nonuniform deposition patterns for single-wafer combinatorial C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33f945a30af0b17d587bb66254cd379e
https://doi.org/10.1063/1.1906183
https://doi.org/10.1063/1.1906183
Publikováno v:
AIChE Journal; Feb2005, Vol. 51 Issue 2, p572-584, 13p, 4 Diagrams, 2 Charts, 5 Graphs
Publikováno v:
Proceedings of the 2004 American Control Conference; 2004, p287-287, 1p