Zobrazeno 1 - 10
of 233
pro vyhledávání: '"Jae Pil Jung"'
Publikováno v:
Materials, Vol 17, Iss 11, p 2661 (2024)
This study was conducted on SAC105 (Sn-1wt.%Ag-0.5wt.%Cu) lead-free solder modified with Bi and Sb. The wetting, melting point, and mechanical properties were analysed with the addition of 1~5 wt.%Bi and 1~5 wt.%Sb for SAC105 base alloy. The wetting
Externí odkaz:
https://doaj.org/article/22eeb8d186ed45e2938f89c81bc2f949
Publikováno v:
Materials, Vol 16, Iss 24, p 7652 (2023)
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and
Externí odkaz:
https://doaj.org/article/16fedb328f914d79a225437eed74cdca
Publikováno v:
Metals, Vol 12, Iss 11, p 1776 (2022)
Bronze cast bells have been designed and developed for hundreds of years, with the worldwide spread of several faiths and religions such as Buddhism, Catholicism, and Protestantism. The exceptional ringtones of bronze bell metals have scientific heal
Externí odkaz:
https://doaj.org/article/1fee65682a2a418fbbb401624a5d82fd
Publikováno v:
Metals, Vol 11, Iss 10, p 1664 (2021)
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-spee
Externí odkaz:
https://doaj.org/article/f6b3a906045f40c4b4f88ff358fdf842
Autor:
Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung
Publikováno v:
Metals, Vol 11, Iss 10, p 1537 (2021)
Real-time health monitoring of civil infrastructures is performed to maintain their structural integrity, sustainability, and serviceability for a longer time. With smart electronics and packaging technology, large amounts of complex monitoring data
Externí odkaz:
https://doaj.org/article/877618faa6ee453db3b47bdd6e23575b
Publikováno v:
Metals, Vol 11, Iss 3, p 509 (2021)
The study was designed to investigate the synergic effect of Ti and Sn in the active metal brazing of Al2O3 ceramic to copper brazed, using the multicomponent Ag-Cu-Zr filler alloy. Numerous fine and hexagonal-shaped rod-like ternary intermetallic (Z
Externí odkaz:
https://doaj.org/article/19de0531837d4da19dae93aa1b3160b5
Publikováno v:
Metals, Vol 11, Iss 2, p 329 (2021)
Noble metal NPs are highly attractive candidates because of their unique combination of physical, chemical, mechanical, and structural properties. A lot of developments in this area are still fascinating the materials research community, and are broa
Externí odkaz:
https://doaj.org/article/c4e55656749842e7964e725eef3f5098
Publikováno v:
Metals, Vol 11, Iss 2, p 364 (2021)
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circ
Externí odkaz:
https://doaj.org/article/70bf1fbc9220427ab66466b3e40208ed
Publikováno v:
Materials Research Express, Vol 8, Iss 1, p 016301 (2021)
Joining technology of silicon semiconductors devices to direct bond copper (DBC) substrates in high-temperature power electronics packages is of utmost importance today. In this study, Sn–Cu solder was prepared by electroplating on a direct bonded
Externí odkaz:
https://doaj.org/article/ccced36c84014f10912c28fc610c033e
Publikováno v:
Metals, Vol 10, Iss 10, p 1295 (2020)
This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes
Externí odkaz:
https://doaj.org/article/2584e764b9bb405abb8b935d090526dc