Zobrazeno 1 - 10
of 88
pro vyhledávání: '"Jae Hee Oh"'
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
Abstract A patterned transparent electrode is a crucial component of state-of-the-art wearable devices and optoelectronic devices. However, most of the patterning methods using silver nanowires (AgNWs), which is one of the outstanding candidate mater
Externí odkaz:
https://doaj.org/article/5ccbfa668ea44119a7546e65aeafb36f
Autor:
Seok Hyeon Hwang, Jin Yeong Song, Hyun Il Ryu, Jae Hee Oh, Seungwook Lee, Donggeun Lee, Dong Yong Park, Sang Min Park
Publikováno v:
Advanced Fiber Materials. 5:617-631
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
Scientific Reports
Scientific Reports
A patterned transparent electrode is a crucial component of state-of-the-art wearable devices and optoelectronic devices. However, most of the patterning methods using silver nanowires (AgNWs), which is one of the outstanding candidate materials for
Autor:
Seok Hyeon Hwang, Jin Yeong Song, Hyun Il Ryu, Jae Hee Oh, Seungwook Lee, Donggeun Lee, Dong Yong Park, Sang Min Park
Publikováno v:
Advanced Fiber Materials. 5:695-695
Autor:
Won Ji Park, Jae Hee Oh, Ji Hyung Kim, Seong Wook Moon, Jeong Hoon Ahn, Ding Shaofeng, Jung Ho Park, Won Hyoung Lee, Min Guk Kang, Choi Yun Ki, Seung Ki Nam, Je Gwan Hwang, Jong Mil Youn
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack cap
Autor:
Joon Nyung Lee, Yuri Y. Masuoka, Jae Hee Oh, Jihyung Kim, Dongju Seo, Ding Shaofeng, Jeong Hoon Ahn, Won Ji Park, Sang-Deok Kwon, Haeri Yoo, Minguk Kang, Choi Yun Ki
Publikováno v:
2020 IEEE International Interconnect Technology Conference (IITC).
The integration of a high aspect ratio Through Silicon Via (TSV) process with the EUV 7nm logic process was developed for the first time. The TSV and MOL to BEOL interface process was developed and the BEOL Via on TSV and MOL structure was evaluated.
Publikováno v:
Thin Solid Films. 518:5630-5636
Epitaxial thin films of a heterostructure with Bi 4 Ti 3 O 12 (BIT)/SrTiO 3 (ST) were successfully grown with a bottom electrode consisting of La 0.5 Sr 0.5 CoO 3 (LSCO) on MgO(001) substrates using pulsed laser deposition. The grown BIT and ST (001)
Publikováno v:
Journal of the Korean Ceramic Society. 46:429-435
Publikováno v:
Scripta Materialia. 59:143-146
Crystalline Nd-substituted Bi4Ti3O12 (BNT) nanopowder was directly produced from a stoichiometric oxide mixture by intense milling. During the milling, mechanical alloying between the constituent oxides occurred, resulting in a sequential phase trans
Autor:
Ji-Sook Lee, Chang-Hwa Song, Eun-Kyeong Jo, Tae-Hyun Paik, Jae-Hee Oh, Jae-Min Yuk, J. Y. Lee, Ji Woong Son, D. M. Shin
Publikováno v:
Scandinavian Journal of Immunology. 67:77-85
CC-chemokine ligand 20 (CCL20), a unique chemokine ligand of CC-chemokine receptor 6 (CCR6), play roles in various pathologic conditions. However, the characteristic expression profiles of CCL20 during human tuberculosis (TB) have been largely unknow