Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jae Hak Yee"'
Autor:
Kyo-Wang Koo, Seung-Zeon Han, Il-Tae Kang, Hyung-Giun Kim, Sung-Hwan Lim, Jae-Hak Yee, Sangshik Kim, So Yeon Park, Mi-Ri Choi, Nam-Kwon Cho, You-Cheol Jang, Taeg-Woo Lee, Yong-Keun Ahn, Young-Jun Jeon
Publikováno v:
Microelectronics Reliability. 55:2306-2315
We found the failure mechanisms in Ag wire bonded to Al pads during the high-temperature-storage lifetime test (HTST) and the unbiased highly-accelerated temperature and humidity storage test (uHAST). The native oxide layer on the Al pads caused a ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ba8a97992139a81f2c303b3f877c015
https://doi.org/10.1016/j.microrel.2015.07.038
https://doi.org/10.1016/j.microrel.2015.07.038
Autor:
Hyoung Dong Kim, Jae Hak Yee, Nam Kwon Cho, Yeo Chan Ko, Mi Ri Choi, Hyung Giun Kim, You Cheol Jang, Il Tae Kang, So Yeon Park, Sung Hwan Lim, Kyo Wang Koo
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Silver wires have become a novel bonding material in recent years. But users & field engineers are still divided over the issue of reliability performance including failure mechanism and intermetallic compounds (IMCs) formation. In this study, new ty
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a30560c7ed7f579ca6fa7fa813d53796
https://doi.org/10.1109/eptc.2014.7028359
https://doi.org/10.1109/eptc.2014.7028359
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
The iNEMI Cu Wire Reliability Project Team has performed reliability tests on a copper wire bonded QFN (Quad Flat No-Lead) package to assess its long term reliability. Bare copper (Cu) and Palladium coated Cu (Pd/Cu) bonding wires were used with a lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::756925a7d50ff65e01cdde06f9ec048c
https://doi.org/10.1109/eptc.2013.6745721
https://doi.org/10.1109/eptc.2013.6745721
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The skyrocketing price of gold has driven the rapid adoption of copper wire in semiconductor packaging. Cu wire is being used for increasingly advanced applications requiring copper wire bond to finer bond pad geometries and structures. Palladium coa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdacf54619dec2af0eaab1393352c5e2
https://doi.org/10.1109/ectc.2012.6249104
https://doi.org/10.1109/ectc.2012.6249104
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1502-1507, 6p