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pro vyhledávání: '"Jacques Margail"'
Publikováno v:
ECS Transactions. 3:79-90
Direct wafer bonding is a generic technology enabling the fabrication of innovative structures. Adequate surface treatments allow bonding of virgin as well as partially or fully processed wafers, leading to new Anti-sticking BSOI, Patterned BSOI and
Autor:
Fabrice Casset, Laurent Jocou, Thomas Jager, Claire Divoux, Julien Charton, Eric Stadler, Jacques Margail, Thierry Enot, Wilfrid Schwartz
Publikováno v:
Scopus-Elsevier
The application of adaptive optics in astronomy requires increasingly compact deformable optical components with a high density of actuators, able to provide strokes of several micrometers. The main problem of the use of adaptive optics in more mains
Publikováno v:
SPIE Proceedings.
Decreasing dimensions of features in semiconductor device manufacturing makes it imperative to control the sidewall, line and line-edge roughness. The roughness contributes to the variation in critical dimension (CD) and it might affect device functi