Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Jacquana Diep"'
Autor:
Jane Frommer, Joseph Sly, Ran Wang, Andy T. Tek, Victoria A. Piunova, Young-Hye La, Leslie E. Thompson, Jacquana Diep
Publikováno v:
Polymer. 103:468-477
A novel water purification membrane has been prepared by layer-by-layer (LBL) assembly of tailored, core–shell star block copolymers. The star block copolymer consists of a hydrophobic polystyrene core (PS) and a plurality of charged hydrophilic ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fcb9e391c3c7d9702e373e5d6776bb4
https://doi.org/10.1016/j.polymer.2015.11.048
https://doi.org/10.1016/j.polymer.2015.11.048
Autor:
Majed S. Nassar, Anthony Szymczyk, E. Idil Mouhoumed, Young-Hye La, Geraud Dubois, Radwan Al-Rasheed, Jacquana Diep
Publikováno v:
Journal of Membrane Science
Journal of Membrane Science, 2014, 466, pp.348-356. ⟨10.1016/j.memsci.2014.05.005⟩
Journal of Membrane Science, Elsevier, 2014, 466, pp.348-356. ⟨10.1016/j.memsci.2014.05.005⟩
Journal of Membrane Science, 2014, 466, pp.348-356. ⟨10.1016/j.memsci.2014.05.005⟩
Journal of Membrane Science, Elsevier, 2014, 466, pp.348-356. ⟨10.1016/j.memsci.2014.05.005⟩
International audience; In this study, hexafluoroalcohol-containing polyamide layer (HFAPA) was prepared on top of a conventional polyamide under-layer (REFPA) via sequential interfacial polymerization (SIP) to improve RO separation behavior, and the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::05d40c93644b896fcf1175aa55baffe4
https://doi.org/10.1016/j.memsci.2014.05.005
https://doi.org/10.1016/j.memsci.2014.05.005
Autor:
Dolores C. Miller, Young Hye La, Benny D. Freeman, Ankit Vora, Blake Davis, Leslie E. Krupp, Geraud Dubois, Geoffrey M. Geise, Majed S. Nassar, Radwan Al-Rasheed, Melanie McNeil, Jacquana Diep
Publikováno v:
Journal of Membrane Science. 437:33-39
A novel thin film composite (TFC) membrane featuring a polyamide bilayer was prepared on a porous polysulfone support using sequential interfacial polymerization. A conventional polyamide membrane prepared using m-phenylenediamine (MPD) in water and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba6e1c94d97e090af5e880701b913a72
https://doi.org/10.1016/j.memsci.2013.02.044
https://doi.org/10.1016/j.memsci.2013.02.044
Publikováno v:
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Optimal thermal design of high-power electronic components often requires use of solder-type thermal interface materials. Pure indium solder provides best combination of mechanical and thermo-mechanical properties for efficient thermal design. Two in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::873075a39a4ba1c16b6f75408d72aca3
https://doi.org/10.1109/stherm.2009.4810762
https://doi.org/10.1109/stherm.2009.4810762
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection to the fragile silicon chip. To achieve these functions
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7c77f0cc0b114f326774931ad705edf
https://doi.org/10.1109/iemt.2008.5507786
https://doi.org/10.1109/iemt.2008.5507786
Publikováno v:
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2008, p1-8, 8p