Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jacob Maxa"'
Autor:
Jacob Maxa, Mathias Nowottnick
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
An active power cycling test-bed for a power MOSFET is presented in this publication. This setup is used to create temperature dependent load cycles of 24 parallel devices. After a passive calibration step the drain-to-source voltage is used to estim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45ed8d8f49b339374b144cafc1beaacb
https://doi.org/10.23919/empc53418.2021.9584958
https://doi.org/10.23919/empc53418.2021.9584958
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000045-000051
Power electronics is a key technology for the advancement and spreading of electromobility applications and compact power supply devices on the market. The use of new WBG semiconductors (e.g. SiC, GaN) as well as highly integrated silicon-based power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62fd98144802bcf8abc7f31f0273c234
https://doi.org/10.4071/2380-4491.2019.hiten.000045
https://doi.org/10.4071/2380-4491.2019.hiten.000045
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Heating processes on printed circuit boards (PCBs) are required for various manufacturing steps and also for different tasks throughout the operation of electronic assemblies. This paper aims to give a brief summary of the state of the art for altern
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f0bfa1049a8b3e85cd7140c53563fb8
https://doi.org/10.23919/empc44848.2019.8951823
https://doi.org/10.23919/empc44848.2019.8951823
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Handling the thermal management of electronic assemblies is an important task for engineers and system designers. Currently, the primarily used technology as heat sinks with or without forced convection were used to transfer heat from the component t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::216f27d6b49c033a6f4e4b3cde7b77f0
https://doi.org/10.1109/estc.2018.8546441
https://doi.org/10.1109/estc.2018.8546441
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The miniaturization in current power electronics results in an increased heat flux density. Despite the higher power demand, the thermal loss is getting a problem. The energy in form of heat must be dissipated to the environment by convection or ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3746c0489bcde3e3401b1aa6947ae62
https://doi.org/10.1109/itherm.2018.8419546
https://doi.org/10.1109/itherm.2018.8419546
Publikováno v:
Materials
Materials, Vol 11, Iss 1, p 31 (2017)
Materials, Vol 11, Iss 1, p 31 (2017)
The inside of modern high power electronics consist of a large amount of integrated circuits for switching and supply applications. This technology has aside the benefits the problem of more and more increasing power density. Nowadays, heat sinks tha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f4f93a9139e577d569ceca065e99777b
http://europepmc.org/articles/PMC5793529
http://europepmc.org/articles/PMC5793529
Publikováno v:
ETFA
A new application for a wireless packet-based serial data transmission using an EEPROM with an I2C and a NFC interface will be presented in this paper. Our system allows the secure exchange of a large amount of data compared to classical NFC applianc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a23c6775f1d2b047dd5b3686d73e0437
https://doi.org/10.1109/etfa.2015.7301578
https://doi.org/10.1109/etfa.2015.7301578