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pro vyhledávání: '"Jackie Backus"'
Autor:
James E. Lamb, Xie Shao, Sean Trautman, John Sullivan, Satoshi Takei, Gu Xu, Jackie Backus, Ken-Ichi Mizusawa, Hiroyoshi Fukuro, Yasuhisa Sone, James B. Claypool, Xiaoming Wu, Yubao Wang
Publikováno v:
SPIE Proceedings.
Among the variety of dual damascene (DD) processes, the via- first approach has drawn much attention because of its reduced process steps and improved photolithography process window. The via-first process requires a layer of via-fill material to be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b8b819c8fa8669dace206d62e44b92f
https://doi.org/10.1117/12.436917
https://doi.org/10.1117/12.436917
