Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Jacinto Jun Jarcia"'
Autor:
Stephen C. K. Wong, Lai Lai Wai, Wei Fan, Albert C. W. Lu, Kim H. Chin, Toshio Yamazaki, Jacinto Jun Jarcia
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
This paper will describe the high-frequency analysis and characterization of embedded resistors fabricated in organic substrates. Although embedded resistors have been widely used in organic substrates, detailed analysis and characterization at high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57fe2eeeac0a2cd701e26ee0f216816e
https://doi.org/10.1115/ipack2005-73345
https://doi.org/10.1115/ipack2005-73345
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
This paper describes a design optimization of power distribution networks using embedded passive technology. A frequency-domain methodology was used to study the impedance characteristics of printed circuit board power planes with embedded decoupling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9c88eba711b1d64abb20a7aff7d5d41
https://doi.org/10.1115/ipack2003-35221
https://doi.org/10.1115/ipack2003-35221