Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Jacek Rudzki"'
Autor:
Alexander Schiffmacher, Ahmad Bashiti, David Strahringer, Juergen Wilde, Carsten Kempiak, Andreas Lindemann, Jacek Rudzki, Henning Stroebel-Maier
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60b92dea5b069714b7430287e094d883
https://doi.org/10.1109/ectc51906.2022.00081
https://doi.org/10.1109/ectc51906.2022.00081
Autor:
Carsten Kempiak, Juergen Wilde, Andreas Lindemann, Jacek Rudzki, Frank Osterwald, Alexander Schiffmacher
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this work an investigation of the thermomechanical deformation behaviour of power modules with sintered metal buffer layers is presented under consideration of the operating time. The thermomechanical deformation is measured during active operatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54cf949fef0baf6933d02d90c2d63106
https://doi.org/10.1109/ectc32862.2020.00094
https://doi.org/10.1109/ectc32862.2020.00094
Autor:
Armin Hindel, Battist Rabay, Ellen Auerswald, Adrian Stelzer, Dan R. Wargulski, Dirk Busse, Mohamad Abo Ras, Jacek Rudzki, Markus Bast
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this work we show the capabilities of non-destructive testing by pulsed infrared thermography (PIRT) on large-area silver-sinter layers. This method can achieve a similar reliability in detecting delamination as SAM and X-ray analysis. The great a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd5b970a2a0c2807984a5e1d9cd4e0d2
https://doi.org/10.23919/empc44848.2019.8951861
https://doi.org/10.23919/empc44848.2019.8951861