Zobrazeno 1 - 10
of 19
pro vyhledávání: '"JJ Beulens"'
Autor:
T. E. F. M. Standaert, M. Schaepkens, P. J. Matsuo, N. R. Rueger, JJ Beulens, Gottlieb S. Oehrlein, Xi Li
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 17:3272-3280
This article describes results obtained using various plasma and surface diagnostics in a study of inductively coupled fluorocarbon plasmas in which the amount of capacitive coupling was systematically varied. It is found that the plasma density decr
Autor:
M. Schaepkens, N. R. Rueger, M. F. Doemling, T. E. F. M. Standaert, JJ Beulens, Gottlieb S. Oehrlein
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 17:2492-2502
Selective etching of SiO2 over polycrystalline silicon has been studied using CHF3 in an inductively coupled plasma reactor (ICP). Inductive powers between 200 and 1400 W, as well as pressures of 6, 10, and 20 mTorr were used in this study of the etc
Publikováno v:
Acta Physica Polonica A. 94:3-12
We study the intensity distribution of the A 2Δ-Χ2Π system of CH molecule at 430 nm in a low pressure plasma jet. This system shows an overlap of vibrational bands with Δν = 0. By comparing simulated and experimental emission spectra, we obtain
Autor:
JJ Beulens, M. Schaepkens, N. R. Rueger, T. E. F. M. Standaert, J. M. Mirza, Gottlieb S. Oehrlein, M. F. Doemling
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 15:1881-1889
It has been found that in the etching of SiO2 using CHF3 in an inductively coupled plasma reactor of the planarized coil design, a thin steady state fluorocarbon film can play an important role in determining the rate of etching. This etching is enco
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 15:1801-1813
The remote plasma chemical dry etching of polycrystalline silicon was investigated using various CF4/O2/N2 gas compositions. The effects of O2 and N2 addition on the etch rate and surface chemistry were established. Admixing O2 to CF4 increases the g
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 14:2802-2813
The chemical dry etching of silicon nitride (Si3N4)and silicon nitride (SiO2) in a downstream plasma reactor using CF4, O2, and N2 has been investigated. A comparison of the Si3N4 and SiO2 etch rates with that of polycrystalline silicon shows that th
Publikováno v:
Plasma Chemistry and Plasma Processing. 14:15-42
A supersonically expanding cascaded arc plasma in argon is analyzed axperimentally by emission spectroscopy. The thermal cascaded arc plasma is allowed to expand through a conically shaped nozzle in the arc anode into the vacuum vessel. In the nozzle
Publikováno v:
Journal of Nuclear Materials, 200(3), 430-433. Elsevier
A new plasma deposition technique is described. In this method a high density and strongly flowing argon plasma is admixed with monomers such as CH/sub 4/, C/sub 2/H/sub 2/, SiH/sub 4/, etc. Through effective charge transfer and dissociative recombin
Publikováno v:
Surface and Coatings Technology. 47:401-417
In this work a strongly flowing cascaded arc burning on an argon-hydrogen mixture is used to dissociate and ionize hydrocarbons which are injected inside a nozzle which is mounted in the anode of the arc. The thermal plasma ( T ≈ 10 000 K , p ≈ 0
Publikováno v:
Journal of Quantitative Spectroscopy and Radiative Transfer, 46(5), 385-392. Elsevier
We have calculated the total radiative loss in an argon plasma at wavelengths from 100 nm to 100 μm (zero absorption) as a function of temperature (3000–15,000 K) for several pressures (10-1 × 106Pa) under LTE and non-LTE conditions. The investig