Zobrazeno 1 - 10
of 135
pro vyhledávání: '"J.T. Yardley"'
Publikováno v:
Journal of Lightwave Technology. 14:1704-1713
Organic polymeric materials offer a versatile medium for the creation of low-cost large-area optical guided-wave structures. In this work, we report on the use of a novel maskless laser-based microfabrication technique for the photochemical delineati
Autor:
J.T. Yardley, I. Ilic, Robert Scarmozzino, Michael J. McFarland, K.W. Beeson, Richard M. Osgood
Publikováno v:
Journal of Lightwave Technology. 12:996-1003
In this paper, we present the first numerical study of highly multimode-input integrated-optic star couplers. Although the design utilizes the physical quantities appropriate for a polymer device, many of the results are applicable to multimode-input
Publikováno v:
IEEE Journal of Quantum Electronics. 26:1521-1526
A new organic electrooptic crystal, 2,6-dibromo-N-methyl-4-nitroaniline, is reported. The crystal structure was determined by X-ray diffraction (orthorhombic, space group Fdd2, point group mm2, Z=16, a=11.745 AA, b=29.640 AA, c=10.807 AA). The refrac
Publikováno v:
IEEE Photonics Technology Letters. 10:93-95
Waveguide polarizers based on embedded thin metallic stacks are proposed. Highly efficient TM polarization is obtained for metal thicknesses smaller than the optical skin depth. The optimal single-metal-layer waveguide is found to yield an extinction
Autor:
Michael J. McFarland, K.W. Beeson, I. Ilic, J.T. Yardley, R. Scannozzino, R.M. Osgood, J. Schweyen
Publikováno v:
Proceedings of IEE/LEOS Summer Topical Meetings: Integrated Optoelectronics.
Autor:
V. Ozgus, W.A. Hennessy, Yue Liu, Julian P. G. Bristow, R.J. Wojnarowski, Richard M. Osgood, Louay Eldada, Andrzej Peczalski, John R. Rowlette, Susant K. Patra, Robert Scarmozzino, Sing H. Lee, Alan Edward Plotts, Y.S. Liu, Michael Aaron Kadar-Kallen, J.T. Yardley, Jared D. Stack
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
The Polymer Optical interconnect Technology (POINT) is a collaborative program among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego (UCSD), sponsored by ARPA, in developing affordable optoelectronic pa
Autor:
Chengzeng Xu, J.T. Yardley, Kelly M. T. Stengel, Louay Eldada, R.A. Nomood, Lawrence W. Shacklette
Publikováno v:
Proceedings of Massively Parallel Processing Using Optical Interconnections.
A versatile polymeric waveguide technology is proposed for massively parallel optical interconnections. We developed a variety a low-loss high-thermal-stability polymeric materials and used them in the fabrication of complex point-to-point optical in
Publikováno v:
[1991] Conference Record. IEEE Instrumentation and Measurement Technology Conference.
An electro-optic characterization apparatus based on an AC modulated Senarmont compensator, which is particularly suited for studying the electro-optic response of thin polymer films, has been developed. The system is capable of measuring the Pockel'
Autor:
Jared D. Stack, R.J. Wojnarowski, John R. Rowlette, Andrzej Peczalski, P. A. Piacente, W.A. Hennessy, J.T. Yardley, Ajay Nahata, Michael Aaron Kadar-Kallen, Yue Liu, Y.S. Liu
Publikováno v:
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
The technical approach and progress achieved under the Polymer Optical Interconnect Technology (POINT) program are described in this paper. The POINT program is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and U
Autor:
R.J. Wojnarowski, Yue Liu, Richard M. Osgood, A. Peczalski, Jared D. Stack, Sing H. Lee, Susant K. Patra, W.A. Hennessy, Michael Aaron Kadar-Kallen, J.T. Yardley, J.P. Bristow, Robert Scarmozzino, John R. Rowlette, Louay Eldada
Publikováno v:
Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting.
Due to the explosive growth in high speed network communication and the rapid advance in the processor speed and processing power, data transfer bandwidths between chips, modules, board, backplane and cabinets have increased drastically. The required