Zobrazeno 1 - 10
of 60
pro vyhledávání: '"J.N. Sweet"'
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 14:529-535
A family of silicon test chips for use in making diagnostic measurements during electronics assembly has been developed. These assembly test chips (ATCs) contain sensors that measure a number of variables associated with assembled IC degradation, inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31aa0208f99f7ed35fa91fc7b426692b
https://doi.org/10.1109/33.83939
https://doi.org/10.1109/33.83939
Autor:
J.N. Sweet
Publikováno v:
AIPR
This paper describes a novel approach to background suppression termed dominant component suppression (DCS) that extends the basic concept in two ways. First, DCS adapts (via unsupervised clustering) to the major backgrounds or dominant components in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65e4cb61c5d8e589c78bf82efa930bb9
https://doi.org/10.1109/aipr.2008.4906468
https://doi.org/10.1109/aipr.2008.4906468
Autor:
J.N. Sweet, D. W. Peterson
Publikováno v:
International Integrated Reliability Workshop Final Report.
A new Assembly Test Chip, ATC04, designed to measure mechanical stresses at the die surface has been built and tested. This CMOS ch@, 0.25 in. on a side, has an array of 25 piezoresistive stress sensing cells, four resistive heaters and two ring osci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::60e64f169f5f11df151218821992af4d
https://doi.org/10.1109/irws.1993.666296
https://doi.org/10.1109/irws.1993.666296
Autor:
J.N. Sweet
Publikováno v:
IEEE Workshop on Advances in Techniques for Analysis of Remotely Sensed Data, 2003.
Hyperspectral images have considerable information content and are becoming common. Analysis tools must keep up with the changing demands and opportunities posed by the new datasets. Many spectral image analysis algorithms depend on a scalar measure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba3e32382440e1f1cfc9e84e25aff8c0
https://doi.org/10.1109/warsd.2003.1295179
https://doi.org/10.1109/warsd.2003.1295179
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
We report the first in situ measurements of thermomechanical stresses in a 1000 I/O 250 /spl mu/m pitch piezoresistive flip chip test chip assembled to a 755 I/O 1.0 mm pitch 35 mm Ball Grid Array (BGA). The BGA substrates employed "build-up" dielect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89783430eb08c447f1f86f7e7022796b
https://doi.org/10.1109/ectc.1999.776397
https://doi.org/10.1109/ectc.1999.776397
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
Accelerated aging (HAST) experiments were conducted with special-purpose corrosion test chips (ATCs) in both bare die form and with various liquid encapsulants: epoxy, silicone and silicone elastomer, or silicone gel. The purpose of the experiment wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6273e5958bc13b7de4b215c7b3b748d8
https://doi.org/10.1109/ectc.1992.204320
https://doi.org/10.1109/ectc.1992.204320
Autor:
J.N. Sweet
Publikováno v:
Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS).
Die cracking and stress induced damage to metal conductors in plastic package integrated circuits have become major reliability issues in recent times. Test chips with structures which can detect cracking or metal damage can be used to qualify new ty
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d3ef0fc28f8858e2a2b9ff2c670f957
https://doi.org/10.1109/irws.1994.515823
https://doi.org/10.1109/irws.1994.515823
Publikováno v:
1994 Proceedings. 44th Electronic Components and Technology Conference.
A new assembly test chip, ATC04, designed to measure mechanical stresses at the die surface has been built and tested. This CMOS chip, 0.25 in. on a side, has an array of 25 piezoresistive stress sensing cells, four resistive heaters and two ring osc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f6ff76529d874a0f66f9c4c30447da4
https://doi.org/10.1109/ectc.1994.367586
https://doi.org/10.1109/ectc.1994.367586
Publikováno v:
1994 Proceedings. 44th Electronic Components and Technology Conference.
We demonstrate the use of HAST and Assembly Test Chips (ATCs) to evaluate the susceptibility of epoxy molding compounds to moisture induced corrosion of Al conductors. We show that the procedure is sufficiently sensitive to discriminate between assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c6a85a998eb27d0a01cf1be11acb98a
https://doi.org/10.1109/ectc.1994.367631
https://doi.org/10.1109/ectc.1994.367631
Publikováno v:
1991 Proceedings 41st Electronic Components & Technology Conference.
Two devices which can be used to evaluate the ability of chip passivation or postbond coatings to protect a Si device from moisture penetration and resultant Al corrosion are described. The first device is a test chip with a number of Al triple track
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48dd68ce2f86b26bdcc3508a03d4ed36
https://doi.org/10.1109/ectc.1991.163961
https://doi.org/10.1109/ectc.1991.163961