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Publikováno v:
Soldering & Surface Mount Technology. 9:39-42
The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn‐40Pb alloy. This alloy has a number of processing advantages(suitable melting point of 183°C and good wetting behaviour). However, under co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad7d5e3a01fe7c03c686a32cf225b6e
https://doi.org/10.1108/09540919710800601
https://doi.org/10.1108/09540919710800601
Autor:
Burgess, Thomas1 (AUTHOR) thomasburgess@trentu.ca, Sukumar, Smera2 (AUTHOR), Thomas, Melissa2 (AUTHOR), Bowman, Jeff1,3 (AUTHOR)
Publikováno v:
Canadian Journal of Zoology. 2024, Vol. 102 Issue 7, p614-621. 8p.
Autor:
Mitchell, Scott J.1 (AUTHOR) scott.mitchell@kcl.ac.uk, Phillips, Grant D.1 (AUTHOR) gphillips001@dundee.ac.uk, Tench, Becks1 (AUTHOR) btench001@dundee.ac.uk, Li, Yunkai1 (AUTHOR) yli002@dundee.ac.uk, Belelli, Delia1 (AUTHOR) d.belelli@dundee.ac.uk, Martin, Stephen J.1 (AUTHOR) s.martin@dundee.ac.uk, Swinny, Jerome D.2 (AUTHOR) jerome.swinny@port.ac.uk, Kelly, Louise2 (AUTHOR) l.kelly@soton.ac.uk, Atack, John R.3 (AUTHOR) atackj@cardiff.ac.uk, Paradowski, Michael3 (AUTHOR) paradowskim@cardiff.ac.uk, Lambert, Jeremy J.1 (AUTHOR) j.j.lambert@dundee.ac.uk
Publikováno v:
Biomolecules (2218-273X). Apr2024, Vol. 14 Issue 4, p460. 22p.
Autor:
Merchant, Michael Allan1,2 (AUTHOR) h_singer@ducks.ca, Battaglia, Michael J.3 (AUTHOR) mjbattag@mtu.edu, French, Nancy3 (AUTHOR) nhfrench@mtu.edu, Smith, Kevin4 (AUTHOR) kevin@hat.bc.ca, Singer, Howard V.1 (AUTHOR) l_armtrong@ducks.ca, Armstrong, Llwellyn1 (AUTHOR) v_harriman@ducks.ca, Harriman, Vanessa B.1 (AUTHOR) s_slattery@ducks.ca, Slattery, Stuart1 (AUTHOR)
Publikováno v:
Remote Sensing. Apr2024, Vol. 16 Issue 7, p1175. 20p.
This report describes the results to date of a program that was initiated to predict and measure residual stresses in Mo-Al{sub 2}O{sub 3} cermet-containing components and to develop new materials and processes that would lead to the reduction or eli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::082d8179e7d35aa5c0409bb832d6b005
https://doi.org/10.2172/552782
https://doi.org/10.2172/552782
A study of thermal expansion for binary Mo-V and ternary Mo-V-Fe/Mo-V-Co alloys has been conducted, with the aim of finding a composition which matches the CTE of 94% alumina ceramic. The overall goal was to identify an alloy which can be used in con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9f0c05105aacd097518efc66254846b
https://doi.org/10.2172/463649
https://doi.org/10.2172/463649
A new viscoplastic theory for CusilABA and other braze alloys has been developed. Like previous viscoplastic theories,this new theory uses a hyperbolic sine function of effective stress in its kinetic equation for the inelastic strain rate. This new
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9262da927760dab9b9bd25312c8a9b0
https://doi.org/10.2172/233338
https://doi.org/10.2172/233338
One important application for the Fe-29Ni-17Co (Kovar{trademark}) alloy in wire form is in brazed feed through assemblies which are integral parts of vacuum electronic devices. Since Cu metal brazes are performed at process temperatures of about 1100
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf4bde22443b341faba068fb22fa6a3c
https://doi.org/10.2172/10111396
https://doi.org/10.2172/10111396
From Host Defense to Metabolic Signatures: Unveiling the Role of γδ T Cells in Bacterial Infections.
Autor:
Nanda, Namya1 (AUTHOR), Alphonse, Martin P.1 (AUTHOR) malphon1@jhmi.edu
Publikováno v:
Biomolecules (2218-273X). Feb2024, Vol. 14 Issue 2, p225. 16p.