Zobrazeno 1 - 3
of 3
pro vyhledávání: '"J.J. Kacines"'
Autor:
Barry K. Gilbert, B.A. Randall, D. Walter, D.J. Schwab, L.E. Roszel, G.J. Fokken, J.J. Kacines, T.M. Schaefer, L. Mowatt
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:403-416
In this paper, we describe the development and measurement of two separate test structures, or "coupons" to assess the performance of Texas Instruments' "chips-first" multichip module technology at high operating clock rates, A "passive" coupon conta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4271995e4e7651f262890aef55f5f75f
https://doi.org/10.1109/96.496045
https://doi.org/10.1109/96.496045
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
Multichip modules have inherent performance advantages over other packaging technologies to which digital designers are turning to meet stringent system performance requirements. However, for designs requiring up to 1 GHz clocks and subnanosecond ris
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24b20cc1b83d2c57e4d7a555c8de3963
https://doi.org/10.1109/ectc.1995.515354
https://doi.org/10.1109/ectc.1995.515354
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.