Zobrazeno 1 - 10
of 64
pro vyhledávání: '"J.H.J. Janssen"'
Publikováno v:
Microelectronics Reliability. 48:1505-1508
Heat diffuses from hot power devices to neighboring components such as bondpads, which shortens the lifetime of bond balls. SOI is a technology with advantages for integrated power applications. For this reason heat transport between components withi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1f6b761992db75610461ecdc60c39fb
https://doi.org/10.1016/j.microrel.2008.07.057
https://doi.org/10.1016/j.microrel.2008.07.057
Autor:
H. J. L. Bressers, Daoguo Yang, L.J. Ernst, L. Goumans, J.H.J. Janssen, D. Y. Gui, K.M.B. Jansen
Publikováno v:
Journal of Applied Polymer Science. 109:2016-2022
Received 27 December 2005; accepted 5 December 2007DOI 10.1002/app.28317Published online 6 May 2008 in Wiley InterScience (www.interscience.wiley.com).ABSTRACT: Molding temperature, molding pressure,and time are three major parameters affecting the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::527d98a0ec6c0cd848405df412007e22
https://doi.org/10.1002/app.28317
https://doi.org/10.1002/app.28317
Autor:
H. J. L. Bressers, Xuejun Fan, W.D. van Driel, M. van Gils, G.Q. Zhang, J.H.J. Janssen, R.B.R. van Silfhout
Publikováno v:
Microelectronics Reliability. 47:273-279
This paper presents a combined numerical and experimental methodology for predicting and preventing moisture induced failures in encapsulated packages. Prevention of such failures will enable efficient and optimal pre-selection of materials, their in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16e9e4a25377cc88ebbe1bf99e9fe9f5
https://doi.org/10.1016/j.microrel.2006.09.011
https://doi.org/10.1016/j.microrel.2006.09.011
Autor:
L.J. Ernst, H. J. L. Bressers, Kaspar M. B. Jansen, W.D. van Driel, J.H.J. Janssen, Daoguo Yang, Guoqi Zhang
Publikováno v:
Microelectronics Reliability. 47:310-318
Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packagin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::925c8852565d82c1d10105da4105689b
https://doi.org/10.1016/j.microrel.2006.09.036
https://doi.org/10.1016/j.microrel.2006.09.036
Publikováno v:
Microelectronics Reliability. 47:233-239
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. Du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::075909a7cc7b6ea293165c794dee284e
https://doi.org/10.1016/j.microrel.2006.09.031
https://doi.org/10.1016/j.microrel.2006.09.031
Publikováno v:
Microelectronics and Reliability : an International Journal and World Abstracting Service, 47(2-3), 179-186. Elsevier
For the development of state-of-the-art Cu/low-k CMOS technologies, the integration and introduction of new low-k materials is one of the major bottlenecks owing to the bad thermal and mechanical integrity of these materials and the inherited weak in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aa8742e47e18921eea0372b1790c80c5
https://doi.org/10.1016/j.microrel.2006.09.003
https://doi.org/10.1016/j.microrel.2006.09.003
Autor:
C.J. Liu, M. van Gils, W.D. van Driel, L.J. Ernst, J.H.J. Janssen, R.B.R. van Silfhout, Guoqi Zhang
Publikováno v:
Microelectronics Reliability. 44:2019-2027
Interfacial delamination is an often-observed failure mode in multi-layered IC packaging structures, which will not only influence the yield of wafer processes, but also have direct impact on the packaging reliability. The difference in coefficient o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9335b67bb1d77e5dee9e91f26b4ae7cc
https://doi.org/10.1016/j.microrel.2004.05.002
https://doi.org/10.1016/j.microrel.2004.05.002
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 27:530-538
A major objective of the European project PROFIT is to generate boundary condition independent (BCI) dynamic compact thermal models (DCTM) of semiconductor products. Extending the methods for steady BCI-CTM developed in preceding projects DELPHI and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::92abef0b5395791c06ce7b598b3ea94b
https://doi.org/10.1109/tcapt.2004.831791
https://doi.org/10.1109/tcapt.2004.831791
Publikováno v:
Journal of Electronic Packaging. 125:520-526
This paper investigates the effect of the anisotropic behavior of the die and the time- and temperature-dependent behavior of epoxy molding compound on the packaging induced stresses for a quad flat package. Finite element (FE) simulations using isot
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4670cdf90487a2645bf32751cb944591
https://doi.org/10.1115/1.1604153
https://doi.org/10.1115/1.1604153
Publikováno v:
Microelectronics and Reliability : an International Journal and World Abstracting Service, 43(5), 765-774. Elsevier
During the manufacturing, testing and service, thermally induced deformations and stresses will occur in IC devices and packages, which may cause various kinds of product failures. FEM techniques are widely used to predict the thermal deformations an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03b5320fa49c3ee543deb3f1a475fdb6
https://research.tue.nl/en/publications/29e3b6ba-bc88-4aef-8fe2-b932515a1ce8
https://research.tue.nl/en/publications/29e3b6ba-bc88-4aef-8fe2-b932515a1ce8